The Parameters Analysis of Lead Bismuth-Heat Transfer Device in the Water Side

Abstract:

The heat transfer device with lead and bismuth is one of the most important equipment to ensure the safe operation of the loop. Though the analysis of sleeve type heat exchange’s flow heat transfer situation, we will get when the lead and bismuth working in the certain circumstance, different thickness of pipe wall, different cooling conditions, have different influence on the heat transfer and thermal stress. When the water side condition is in certain circumstance, as the thickening of the tube wall and the increasing of wall thermal stress,, thin wall can reduce thermal resistance and thermal stress, but faced the corrosion of lead and bismuth at the same time,. Under the condition of the same thickness of the wall, water with higher pressure and temperature can reduce thermal stress, but because of low temperature difference, the economy of heat transfer device is not good. So, in the design of lead bismuth-heat transfer device, we should fully take into account the influence of water side parameters.

• Periodical: Advanced Materials Research (Volumes 1008-1009)
• Pages: 938-943
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1008-1009.938
• Online since: August 2014
• Authors: Tao Zhou*, Yun Bo Li, Meng Ying Liu
• Keywords: Bismuth, Heat Transfer, Lead, Sleeve Type Exchanger, Temperature Difference, Thermal Stress

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