Investigation of Solid Solubility, Hardness, and Thermal Properties of Au-Ge-Sb System

Article Preview

Abstract:

In recent years, the Au-Ge-Sb system has been studied as a possible alternative alloy for soldering applications [1-4]. The alloy has various fbenefits such as (i) low melting temperature which allows the alloy system to be used as a drop-in solution for high performance lead-free solders, (ii) three distinct phases of different hardness values (100, 150 and 500 HV) which offer the ability to fine tune the composition and microstructure to a wide range of properties, and (iii) limited solute solubility which offers ease of control and fine-tuning of microstructure, mechanical properties and colors. Gold compositions centered around 75wt% gold were modeled and selected using the CALPHAD (CALculation of PHAse Diagram) method. Predictions were later confirmed by experimental results. The alloy solidifies in the range of 242.5-261.7 °C. The overall hardness values were measured and confirmed to be within the volume average value of all the phases combined.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

336-341

Citation:

Online since:

August 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] Chidambaram, Vivek, John Hald, and Jesper Hattel. Development of Au–Ge based candidate alloys as an alternative to high-lead content solders., Journal of Alloys and Compounds 490. 1 (2010): 170-179.

DOI: 10.1016/j.jallcom.2009.10.108

Google Scholar

[2] Wang, J., C. Leinenbach, and M. Roth. Thermodynamic description of the Au–Ge–Sb ternary system., Journal of Alloys and Compounds 485. 1 (2009): 577-582.

DOI: 10.1016/j.jallcom.2009.06.030

Google Scholar

[3] Leinenbach, C., et al. Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates., Journal of electronic materials 40. 7 (2011): 1533-1541.

DOI: 10.1007/s11664-011-1639-4

Google Scholar

[4] Chidambaram, Vivek, et al. A corrosion investigation of solder candidates for high-temperature applications., JOM 61. 6 (2009): 59-65.

DOI: 10.1007/s11837-009-0089-4

Google Scholar

[5] Lau, John H. Reliability of ROHS-compliant 2D and 3D IC Interconnects. McGraw-Hill, (2011).

Google Scholar

[6] Ainslie, Norman G., James E. Krzanowski, and Paul H. Palmateer. High melting point process for Au: Sn: 80: 20 brazing alloy for chip carriers., U.S. Patent No. 4, 418, 857. 6 Dec. (1983).

Google Scholar

[7] Andersson, J. O., et al. Thermo-Calc & DICTRA, computational tools for materials science., Calphad 26. 2 (2002): 273-312.

DOI: 10.1016/s0364-5916(02)00037-8

Google Scholar

[8] Sigrid Furuseth, Kari Selte, Arne Kjekshus, P. H. Nielsen, Berndt Sjöberg, and Erik Larsen. Redetermined Crystal Structures of PdAs2, PdSb2, PtP2, PtAs2, PtSb2, a-PtBi2, and AuSb2., Acta Chem Scand 19. 3 (1965): 735-741.

DOI: 10.3891/acta.chem.scand.19-0735

Google Scholar

[9] Ronald W. Armstrong. The Hardness and Strength Properties of WC-Co Composites., Materials 2011, 4: 1287-1308.

DOI: 10.3390/ma4071287

Google Scholar