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Investigation of Solid Solubility, Hardness, and Thermal Properties of Au-Ge-Sb System
Abstract:
In recent years, the Au-Ge-Sb system has been studied as a possible alternative alloy for soldering applications [1-4]. The alloy has various fbenefits such as (i) low melting temperature which allows the alloy system to be used as a drop-in solution for high performance lead-free solders, (ii) three distinct phases of different hardness values (100, 150 and 500 HV) which offer the ability to fine tune the composition and microstructure to a wide range of properties, and (iii) limited solute solubility which offers ease of control and fine-tuning of microstructure, mechanical properties and colors. Gold compositions centered around 75wt% gold were modeled and selected using the CALPHAD (CALculation of PHAse Diagram) method. Predictions were later confirmed by experimental results. The alloy solidifies in the range of 242.5-261.7 °C. The overall hardness values were measured and confirmed to be within the volume average value of all the phases combined.
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336-341
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August 2014
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© 2014 Trans Tech Publications Ltd. All Rights Reserved
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