Grinding Performance of Diamond Grinding Tools for Sapphire Crystal

Article Preview

Abstract:

In order to improve the efficiency and reduce the cost of sapphire crystal machined by loose abrasive lapping, the fixed-abrasive diamond grinding tools for sapphire grinding were investigated in this paper. Four vitrified-resin composite bond diamond grinding tools with different grain sizes (40μm, 20μm, 7μm, 2.5μm) were developed. The grinding experiments were performed with the developed diamond grinding tools and the grinding performance of four grinding tools were evaluated by comparing the surface roughness and the material removal rate (MRR) of sapphire. The experiment results show that with the increase in grain size, both the MRR and the surface roughness increase. A high-efficiency and high-quality ultra-precision grinding process using diamond grinding tools with different grain sizes was proposed.

You might also be interested in these eBooks

Info:

Periodical:

Pages:

544-548

Citation:

Online since:

September 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] M.S. Akselrod, F.J. Bruni, Modern trends in crystal growth and new applications of sapphire, Cryst. Growth, 360 (2012) 134-145.

DOI: 10.1016/j.jcrysgro.2011.12.038

Google Scholar

[2] X.H. Niu, Y.L. Liu, B. M. Tan, et al. Method of surface treatment on sapphire substrate, Trans Nonferrous Met Soc China, Supplement 2 16 (2006) 732-734.

Google Scholar

[3] Kasman, E. and M. Irvin. Waste reduction in lapping sapphire and other compound semiconductor materials. in CS MANTECH Conference, Portland, Oregon, USA. (2010).

Google Scholar

[4] Z.G. Dong, S. Gao, P. Zhou, et al. Grinding Performance Evaluation of the Developed Chemo-Mechanical Grinding (CMG) Tools for Sapphire Substrate, Adv. Mater. Res., 565 (2012) 105-110.

DOI: 10.4028/www.scientific.net/amr.565.105

Google Scholar

[5] B.H. Lv, J.L. Yuan, Y.X. Yao, Study on fixed abrasive lapping technology for ceramic balls, Mater Sci Forum, 532- 533 (2006) 460- 463.

DOI: 10.4028/www.scientific.net/msf.532-533.460

Google Scholar

[6] J. Li, P. Gao, Y.W. Zhu, et al. Research on Subsurface Damage After Abrasives and Fixed-Abrasive Lapping of K9 Glass, Key Eng Mat, 487 (2011) 253-256.

DOI: 10.4028/www.scientific.net/kem.487.253

Google Scholar

[7] P. Gao, J. Li, Y. Zhu, et al. Study on Subsurface Damage after Fixed-Abrasive Lapping with Different Particle Size, Diffus. Defect Data B, Solid State Phenom, 175 (2011) 112-115.

DOI: 10.4028/www.scientific.net/ssp.175.112

Google Scholar

[8] S. Gao, Z.G. Dong, R. K. Kang, et al. Design and evaluation of soft abrasive grinding wheels for silicon wafers, J. Proc. Inst. Mech. Eng., B, Eng. Manuf., 227 (2013) 578-86.

Google Scholar