Characterization of Cutting Ability of Electroplated Diamond Wire Used for Multi-Wire Saw

Hyoung Jae Kim; Do Yeon Kim; Sang Jik Lee; Hae Do Jeong; Hon Jong Choi

doi:10.4028/www.scientific.net/AMR.1017.549

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1017Characterization of Cutting Ability of...

Characterization of Cutting Ability of Electroplated Diamond Wire Used for Multi-Wire Saw

Abstract:

Diamond abrasive coated wires are core tools for precision multi-wire sawing of mono-crystal ingots for substrate manufacturing, especially for hard materials applications such as SiC, GaN, sapphire and silicon. However, repeated contact by reciprocation motion of wire makes it difficult to design optimized utilization of diamond wires since it makes temporal change in cutting performance due to gradual wear of abrasives. In this paper, the cutting performance of wires are examined based on experimental results with wires having different concentration. The results indicated that the concentration of diamond abrasives have strong relationship with cutting performance and wires with low concentration showed higher material removal characteristics.

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Periodical:

Advanced Materials Research (Volume 1017)

Pages:

549-552

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1017.549

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Online since:

September 2014

Authors:

Hyoung Jae Kim, Do Yeon Kim, Sang Jik Lee, Hae Do Jeong, Hon Jong Choi*

Keywords:

Concentration, Cutting Tool, Diamond Abrasive, Diamond Wire, Ingot, Multi-Wire Saw

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