Study of the Slurry in CMP 304 Ultra-Thin Stainless Steel Surface

Jia Peng Chen; Jian Guo Yao; Li Jie Ma; Su Fang Fu; Jian Xiu Su

doi:10.4028/www.scientific.net/AMR.1027.235

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Study of the Slurry in CMP 304 Ultra-Thin Stainless Steel Surface
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1027Study of the Slurry in CMP 304 Ultra-Thin...

Study of the Slurry in CMP 304 Ultra-Thin Stainless Steel Surface

Abstract:

Flexible displays will become the mainstream display of next generation, so the manufacturing technology of the flexible display substrate is one of very important technologies. In this paper, according to orthogonal design, the composition selection and optimization of chemical mechanical polishing (CMP) slurry based on alumina abrasive had been done in CMP ultra-thin stainless steel surface by a lot of tests. The CMP slurry based on alumina abrasive for ultra-thin stainless steel surface had been obtained. According to the test results, the material removal rate (MRR) is about 177 nm/min and the surface roughness (Ra) is about 0.018μm.

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Periodical:

Advanced Materials Research (Volume 1027)

Pages:

235-239

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1027.235

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Online since:

October 2014

Authors:

Jia Peng Chen, Jian Guo Yao, Li Jie Ma, Su Fang Fu, Jian Xiu Su*

Keywords:

Chemical Mechanical Polishing, Material Removal Rate (MRR), Polishing Slurry, Surface Roughness (SR), Ultra-Thin Stainless Steel

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* - Corresponding Author

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