Influences of SiC Particle Size and Electroless Plating on the Properties of SiCp/Cu Composites

Li Li Tang; Ming Hu; Lin Shan; Yun Long Zhang

doi:10.4028/www.scientific.net/AMR.1030-1032.103

Paper Titles

Formation Mechanism of Thixotropic Microstructure of AM60 Alloy during Solidification
p.86

Influence of Layer Charge and Modifier on Wettability of Organo-Montmorillonite
p.90

Influence of Subcritical Quenching on Microstructure and Properties of Steel 22SiMnCrNi2Mo
p.95

Influence Study on the New Raw Materials on Design and Production of Sweaters
p.99

Influences of SiC Particle Size and Electroless Plating on the Properties of SiC_p/Cu Composites
p.103

Investigation on Grain Refinement of AZ31 Alloy by Self-Inoculation Method
p.108

Magnetic Molecularly Imprinted Polymers Based on Poly[2,2’-(p-oxidiphenylene)-5,5’-bibenzimidazole] (OPBI) for Selective Detection of Nonylphenol in Water Samples
p.112

Mechanism of Microwave Assisted Technique Acid Leaching Coal Gangue
p.116

Modeling of the Adsorption Mechanisms and Selectivity of the Molecular Imprinted Particles for Norfloxacin
p.121

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 1030-1032Influences of SiC Particle Size and Electroless...

Influences of SiC Particle Size and Electroless Plating on the Properties of SiC_p/Cu Composites

Abstract:

Electroless plating technology was applied in order to improve the poor wettability between the copper and SiC. SiC_p/Cu composites were frbricated by hot-press sintering technique. The influences of SiC particles (Cu-coated and Cu-uncoated) and SiC_p/Cu-5vol%n-SiC on microstructures, relative density, bending strength and coefficient of thermal expansion(CTE) were researched in detail. The results show that SiC particles distributed in Cu matrix uniformly. And a certain amount of SiC, the relative density and bending strength of SiC_p/Cu(Cu-coated) composite were greater than SiC_p/Cu(Cu-uncoated) composite, and the coefficient of thermal expansion was opposite, Between SiC_p/Cu(Cu-coated) and SiC_p/Cu-5vol% nanoscale SiC(n-SiC), the relative density and bending strength of SiC_p/Cu(Cu-coated) were more than SiC_p/Cu-5vol%n-SiC, and CTE was different.

You might also be interested in these eBooks

Materials, Transportation and Environmental Engineering II

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 1030-1032)

Pages:

103-107

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1030-1032.103

Citation:

Cite this paper

Online since:

September 2014

Authors:

Li Li Tang*, Ming Hu, Lin Shan, Yun Long Zhang

Keywords:

Bending Strength, Chemical Plating, Coefficient of Thermal Expansion, SiC_p/Cu Composite

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] Jianhua Zhu, Lei Liu, Bin Shen, Wenbin Hu. Mechanical properties of Cu/SiCp composites fabricated by composite electroforming. Materials letters, 2007; 61: 2804-2809.

DOI: 10.1016/j.matlet.2006.10.051

Google Scholar

[2] H.R. Akramifard, M. Shamanian, M. Sabbaghian, M. Esmailzadeh. Microstructure and mechanical properties of Cu/SiC metal matrix composite fabricated via friction stir processing. Materials and Design, 2014; 54: 838-844.

DOI: 10.1016/j.matdes.2013.08.107

Google Scholar

[3] Mohsen Barmouz, Mohammad Kazem Besharati Givi, Javad Seyfi. On the role of processing parameters in producing Cu/SiC metal matrix composites via friction stir processing. Investigating microstructure, microhardness, wear and tensile behavior. Materials Characterization, 2011; 62: 108-117.

DOI: 10.1016/j.matchar.2010.11.005

Google Scholar

[4] G. Celebi Efe, T. Yener, I. Altinsoy, M. Ipek, S. Zeytin, C. Bindal. The effect of sintering temperature on some properties of Cu–SiC composite. Journal of Alloys and Compounds. 2011; 509: 6036-6042.

DOI: 10.1016/j.jallcom.2011.02.170

Google Scholar