Modeling of Physical and Chemical Processes of Anodic Bonding Technology

N.S. Pshchelko; M.P. Sevryugina

doi:10.4028/www.scientific.net/AMR.1040.513

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1040Modeling of Physical and Chemical Processes of...

Modeling of Physical and Chemical Processes of Anodic Bonding Technology

Abstract:

Modeling ideas of physical and chemical processes when using an anodic bonding for materials connection are developed. The kinetics of a charge accumulation in an electrode region in a dielectric is considered. The thickness of a charge layer, electric fields strength and value of the ponderomotive pressure providing connection of materials are calculated. It is shown that the necessary ponderomotive pressure resulting in a dielectric-to-conductor seal is normally about ten MPa and the time required is about ten minutes.

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Periodical:

Advanced Materials Research (Volume 1040)

Pages:

513-518

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1040.513

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Online since:

September 2014

Authors:

N.S. Pshchelko*, M.P. Sevryugina

Keywords:

Anodic Bonding, Charge Accumulation, Connection of Materials, Electric Field, Mathematical Modeling, Physical Modeling, Technological Processes

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References

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