Electroless Deposition of Copper Nanostructures in Aqueous Solution

Abstract:

This paper reports a simple and low cost process for the synthesis of various Cu nanostructures by electroless deposition. Oxidation-stable Cu nanoparticles and nanowires were prepared in aqueous solution in the presence of protective agents. When gelatin is used as protective agent, only spherical Cu nanoparticles with a mean diameter in the range of 37 to 44 nm are formed in the solution. Smaller nanoparticles are prepared at a higher concentration of gelatin. When ethylene diamine is used instead of gelatin, one-dimensional growth of Cu nanowires is favored. Varying the amount of EDA and gelatin provides morphological control over the nanostructures.

• Periodical: Advanced Materials Research (Volume 1043)
• Pages: 114-118
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1043.114
• Online since: October 2014
• Authors: Michael Tan*, Lance de Jesus, Kathy Lois Amores, Ellaine Datu, Mary Donnabelle Balela
• Keywords: Copper Nanoparticles, Copper Nanowires, Electroless Deposition

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