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Reliability Analysis of Mobile Phones’ Acoustic Dust-Proof Mesh against Contaminated Environment
Abstract:
Dust particles and organic contaminants in environment can intrude into electronic device interior through the shell and opening holes. The intrusive contaminants can adhere on electric contact interface. Therefore, it can reduce components’ electric connection reliability. Widely it used acoustic dust-proof mesh to protect the mobile phone and other electric devices’ earpieces and speakers from contamination intrusion. This preventing contamination role makes much dust particles and organics adhere on the mesh. It is necessary to evaluate dust-proof mesh ability against contamination. In this paper, actual field contaminated meshes have been taken failure analysis. Then, lab simulation experiments have been established with considering meshes and contaminants’ characters. Finally the influence of mesh’s parameter on contamination has been researched.
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802-805
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Online since:
October 2014
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© 2014 Trans Tech Publications Ltd. All Rights Reserved
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