A Novel Structural Design of Heat-Dissipation Method for High Brightness LED Lighting with Thermoelectric Chip Module

Abstract:

In various traditional technologies of solving the heat-dissipation problem for LED, all of these methods exhaust the waste heat into the environment and cause the more serious greenhouse effect. In this article, we present a new heat-dissipation method for high brightness 10W LED bulb using a novel structure of thermoelectric chip module. Evidence illustrates that graphite performs both the best heat-absorption material as well as the superior heat-dissipation material for LED thermoelectric chip module. Besides, the double-layered structure with graphite as heat-conduction material of LED thermoelectric module could create the most temperature-difference and thus conduct the highest output power. It implies that double-layered structure of LED thermoelectric chip module with graphite as heat-conduction material is the optimal structure for heat-dissipation of 10W LED bulb.

• Periodical: Advanced Materials Research (Volume 1051)
• Pages: 823-827
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1051.823
• Online since: October 2014
• Authors: Ching Wu Wang*, Ti Chun Yeh, Kai Chun Lin, Kuan Hsun Chen, Wei Chih Wang, Po Kai Lin, Chien Hua Chen, Ta Yu Chiu, Chih Wei Wu
• Keywords: Green House Effect, Heat-Dissipation, LED Lighting, Thermoelectric Chip Module

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