Modeling and Predicting Grinding Force of the Grinding Process

Nai Li Zhao; Wen Fang Guan

doi:10.4028/www.scientific.net/AMR.1055.165

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1055Modeling and Predicting Grinding Force of the...

Modeling and Predicting Grinding Force of the Grinding Process

Abstract:

A new method for predicting the grinding force is developed in this paper. The grinding forces model is build by divided it into cutting deformation force and sliding force and combine the undeformed chip thickness which assume the height of grits obey the Rayleigh distribution. In this model, the influence of processing parameters on friction is considered and takes into consideration the kinematic conditions, material properties, wheel microstructure and dynamic effects. In the last, this new grinding model is tested and verified.Keywords Grinding force; Undeformed chip thickness; Ground finish

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Periodical:

Advanced Materials Research (Volume 1055)

Pages:

165-170

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1055.165

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Online since:

November 2014

Authors:

Nai Li Zhao, Wen Fang Guan

Keywords:

Grinding Force, Ground Finish, Undeformed Chip Thickness

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