Study on Three Dimensional Direct Coupling Simulation of Induction Heating for Hot Stamping

Yong Li; Xiong Liang; Zhao Dong Wang; Jia Dong Li; Tian Liang Fu

doi:10.4028/www.scientific.net/AMR.1063.280

Paper Titles

High-Strength Steel Door-Beam Design and Digital Simulation
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Analysis of the Design and Mechanical Performance about Hot Stamping Power Fitting Products
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The Parametric Design of Cooling System of Hot Stamping Die
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Study on Three Dimensional Direct Coupling Simulation of Induction Heating for Hot Stamping
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Thermo-Mechanical Forming Analysis and Mapping of Material Properties in Press Hardened Components with Tailored Material Properties
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Local Design and Near Net Shape Optimization of Typical Ultra-High Strength Steel B-Pillar in Hot Stamping
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The Process Optimization to Prevent the Local Wrinkles of Hot Stamping Parts and the Design of Tools
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Spring-Back Control in Automotive Door Inner Panel Stamping
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1063Study on Three Dimensional Direct Coupling...

Study on Three Dimensional Direct Coupling Simulation of Induction Heating for Hot Stamping

Abstract:

As to the conventional hot stamping furnance’s shortcomings of long heating time, easy oxidized, high energy consumption, the application of induction heating for hot stamping were studied. By using COMSOL Multiphysics software, we calculated the electromagnetic induction field and temperature field by use of the direct coupling (Direct Coupling Method) in the heating process of hot forming sheet and studied the influence of inductor device parameters (such as induction length, distance between inductor and sheet etc.) and various process parameters (such as the power supply frequency, current density, sheet thickness etc.) on heating rate and temperature distribution. That will have a good guidance on the application of induction heating to hot stamping field.

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Periodical:

Advanced Materials Research (Volume 1063)

Pages:

280-289

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1063.280

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Online since:

December 2014

Authors:

Yong Li*, Xiong Liang, Zhao Dong Wang, Jia Dong Li, Tian Liang Fu

Keywords:

COMSOL, Direct Coupling Method, Electromagnetic Field, Hot Stamping, Induction Heating, Temperature Field

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