Convection Condition Variation Analysis on Thermal Dissipation of High Power Single Chip LED

Abstract:

High power light emitting diodes (LEDs) characteristics in terms of efficiency, long operating life and reliability which has lead to its application as lighting systems. However, the high power LEDs are subjected to thermal challenges due to it high input power. This work reports simulation analysis on a single chip high power LED to where thermal performances of the LED package were evaluated under varied convection condition. The simulation was carried out using Ansys version 11. The heat dissipation evaluated and compared in terms of junction temperature, von Mises stress and thermal resistance at each respective convection condition with constant input power of 1 W.

• Periodical: Advanced Materials Research (Volume 1082)
• Pages: 336-339
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1082.336
• Online since: December 2014
• Authors: Vithyacharan Retnasamy*, Zaliman Sauli, Rajendaran Vairavan, Hussin Kamarudin, Mukhzeer Mohamad Shahimin, Steven Taniselass, P. Susthitha Menon
• Keywords: ANSYS, Convection Condition, High Power LED, Junction Temperature

References

[1] Y. Han, H. Guo, X. Zhang, F. Yin, K. Chu, and Y. Fan, Thermal performance analysis of LED with multichips, Journal of Wuhan University of Technology-Mater. Sci. Ed., vol. 26, pp.1089-1092, (2011).

DOI: 10.1007/s11595-011-0368-0

[2] P. Anithambigai, K. Dinash, D. Mutharasu, S. Shanmugan, and C. K. Lim, Thermal analysis of power LED employing dual interface method and water flow as a cooling system, Thermochimica Acta, vol. 523, pp.237-244, (2011).

DOI: 10.1016/j.tca.2011.06.001

[3] W. Jun, Z. Meilin, L. Shuzhi, Y. Weiqiao, and Z. Jianhua, Study on the application of thermal interface materials for integration of HP-LEDs, in CPMT Symposium Japan, 2010 IEEE, 2010, pp.1-5.

DOI: 10.1109/cpmtsympj.2010.5680285

[4] N. Teeba, L. Kean Yew, L. C. Keng, P. Anithambigai, K. Dinash, and D. Mutharasu, Study on the variation in thermal resistance and junction temperature of GaN based LEDs using thermal transient measurement, in Quality Electronic Design (ASQED), 2011 3rd Asia Symposium on, 2011, pp.310-314.

DOI: 10.1109/asqed.2011.6111766

[5] C. P. Wang, T. T. Chen, H. K. Fu, T. L. Chang, and P. T. Chou, Transient Analysis of Partial Thermal Characteristics of Multistructure Power LEDs, Electron Devices, IEEE Transactions on, vol. 60, pp.1668-1672, (2013).

DOI: 10.1109/ted.2013.2252903

[6] R. Vairavan, Z. Sauli, V. Retnasamy, N. Khalid, K. Anwar, and N. Abdullah, Natural Heat Convection Analysis on Cylindrical Al Slug of LED, Applied Mechanics and Materials, vol. 487, pp.536-539, (2014).

DOI: 10.4028/www.scientific.net/amm.487.536

[7] R. Vairavan, Z. Sauli, V. Retnasamy, R. C. Ismail, N. I. M. Nor, N. S. Nadzri, and H. Kamarudin, High Power LED Thermal and Stress Simulation on Copper Slug, in Computer Modelling and Simulation (UKSim), 2013 UKSim 15th International Conference on, 2013, pp.294-298.

DOI: 10.1109/uksim.2013.150

[8] D. Butterworth and D. Council, Introduction to heat transfer vol. 18: Oxford University Press for the Design Council, the British Standards Institution and the Council of Engineering Institutions, (1977).

[9] H. H. Cheng, D. -S. Huang, and M. -T. Lin, Heat dissipation design and analysis of high power LED array using the finite element method, Microelectronics Reliability, vol. 52, pp.905-911, (2012).

DOI: 10.1016/j.microrel.2011.05.009