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Copper Based Heat Slug Structure Variation Analysis on Heat Dissipation of High Power LED

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Abstract:

Excess heat generated by the high power LED package significantly impacts the performance and reliability of the light source. Significance of heat dissipation are influenced by each packaging component of high power LED. This paper demonstrates simulation analysis on single chip high power LED where the significance of the copper based heat slug structure on the heat dissipation was analyzed. The simulation analysis was carried out by using Ansys version 11 and heat dissipation of two types of heat slug structure, rectangular and cylindrical were compared. The outcome exhibited that the structure of the heat slug significantly influences the heat dissipation of LED chip due to its surface area.

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Periodical:

Advanced Materials Research (Volume 1082)

Pages:

340-343

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1082.340

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Online since:

December 2014

Authors:

Vithyacharan Retnasamy*, Zaliman Sauli, Rajendaran Vairavan, Hussin Kamarudin, Mukhzeer Mohamad Shahimin, Steven Taniselass, P. Susthitha Menon

Keywords:

ANSYS, Copper Heat Slug, Heat Slug Structure, High Power LED, Junction Temperature, Von Mises Stress

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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* - Corresponding Author

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