Experimental Study on the Surface Cutting Mechanical Properties of Single Crystal Silicon in Micro-Nano Scale

Abstract:

The experiment of cutting mechanical properties of single crystal silicon surface in the micro-nanoscale is researched using nanoindenter and atomic force microscopy. The result of the experiment shows that: in the constant load, the impact of different scratching velocity for single crystal silicon surface scratch groove width and chip accumulation volume are not big; but the cutting force and friction coefficient are not increases with the scratching velocity increases; when the scratching speed is certain, the size of load has a greater impact on the cutting mechanical properties of single crystal silicon surface, with the increase of the load, the cutting force increases, but the cutting force is not linearly growth.

• Periodical: Advanced Materials Research (Volume 1088)
• Pages: 779-782
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1088.779
• Online since: February 2015
• Authors: Xiao Jing Yang*, Yong Li, Wei Xing Zhang
• Keywords: Cutting Mechanical Properties, Micro-Nanoscale, Scratch, Single Crystal Silicon

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