Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy

Li Ma; Qiang Hu; Yan Bin Sun

doi:10.4028/www.scientific.net/AMR.1095.95

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1095Effect of Cu on the Electrochemical Corrosion...

Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy

Abstract:

The electrochemical corrosion behavior of the Sn-8Zn-3Bi-xCu lead-free solder in 3.5%NaCl solution was studied to reveal effect of Cu addition on the corrosion resistance of Sn-8Zn-3Bi solder alloy. The results showed that adding Cu element increased the corrosion potential of Sn-8Zn-3Bi-xCu solder alloysThe corrosion resistance of Sn-8Zn-3Bi-xCu solder alloys was improved correspondingly. The corrousion product of Sn-8Zn-3Bi-xCu alloy was mainly zinc oxide. More corrosion products were observed with the increse of Cu content.

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Periodical:

Advanced Materials Research (Volume 1095)

Pages:

95-98

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1095.95

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Online since:

March 2015

Authors:

Li Ma, Qiang Hu*, Yan Bin Sun

Keywords:

Corrosion, Cu Addition, Lead-Free Solder, Sn-8Zn-3Bi

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