Research on Heat Resisting Epoxy Resin System for Liquid Composite Molding

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The properties of heat resistance and manufacturability of epoxy resin system are contradictory to each other. In order to maintain the balance of both properties, this article studied the heat resistance (testing the glass-transition temperature using differential scanning calorimetry) and the manufacturability (characterizing the variation trend of viscosity at molding temperature using AR2000EX rotational rheometer) of two kinds of epoxy resin systems by means of designing orthogonal table. Studies show that when the mass ratio of hydantoin epoxy resin, MF-4101 epoxy resin, anhydride and accelerant is 100:20:150:1.5, the glass transition temperature of the epoxy resin system can reach over 180°C. What’s more, the initial viscosity of the epoxy resin at 40°C is about 230mPa•s, and the viscosity can maintain no more than 800mPa•s in approximately 3 hours, which meets the requirements of liquid composite molding.

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8-14

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April 2015

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© 2015 Trans Tech Publications Ltd. All Rights Reserved

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[1] L.Y. Wu. Status of advanced aerospace composite materials. CEATI. 117-132.

Google Scholar

[2] C.R. Clinton, V.L. Rausch, J. Sitz, et al. 10th Int. Space. Plane. Technol. Conference. (2001).

Google Scholar

[3] K. Sawada, M. Takashi. Conceptual design of two-stage reusable launch systems using X-33. 10th Int. Space. Plane. Technol. Conference. (2001).

DOI: 10.2514/6.2001-1790

Google Scholar

[4] C.S. Gibson, J.C. Neidhoefer, S.M. Cooper, et al. Development and flight test of the X-43A-LS hypersonic configuraion UAV. 1st Unmanned Aero. Vehicl. Technol. (2002).

DOI: 10.2514/6.2002-3462

Google Scholar

[5] K. Wang, X.H. Yu, Y.F. Xu. Research progress of epoxy adhesives with high-temperature resistance. Adhesion. 2013, 2: 63-65.

Google Scholar

[6] X.B. Liu, X.J. Wang, X.M. Hui. Progress in epoxy resin of high-temperature resistance. FRP/CM. 2013, 3: 118-121.

Google Scholar

[7] P.H. Liang, H. Su, S.H. Hu, H.J. Ji, Formulation design on high temperature resistant epoxy resin casting materials. Insulating mater. 2008, 41(2): 29-33.

Google Scholar

[8] M. Zhang, C.Z. Wang, D.Z. Wu, Y.H. Yu, et al. Study on toughening of heat-resistant epoxy resin. Chin. Plast. Ind. 2004, 32(5): 11-13.

Google Scholar

[9] X.Y. Hu, X.L. Yuan. Progress in high temperature resistant epoxy resin adhensives. Chem. Adhes. 2009, 31(9): 49-52.

Google Scholar

[10] S. Sun, M.J. Liu, H. Wang, T.F. Cu. RTM molding process and its derive technology. Areos. Mater. Technol. 2010, (6): 21-23.

Google Scholar

[11] F.J. Kong, Y.F. Y.Q. Liu. Research in composite RTM molding process parameters. Eng. Plast. Appl. 2009, 37(4): 42-44.

Google Scholar

[12] G. Yan, X.B. Fan, X.M. Zhang, et al. Effects of RTM process parameters on the performance of composites. Develop. Appl. Mater. 2008, 23(2): 27-30.

Google Scholar

[13] B.J. Zhu. Research on the heterogeneous repair of the injury of honeycomb-core T700/QY9611 composite sandwich structures. Changsha. 2013. 27-30.

Google Scholar

[14] L.A. Mercado, M. Galia, J.A. Reina, Silicon-containing flame retardant epoxy resins: synthesis, characterization and properties. Polym. Degrad. Stab. 2006, 91: 2588-2594.

DOI: 10.1016/j.polymdegradstab.2006.05.007

Google Scholar

[15] W.J. Wang, L.H. Perng, G.H. Hsiue. Characterization and properties of new silicone-containing epoxy resin. Polym. 2000, 41: 6113-6122.

DOI: 10.1016/s0032-3861(99)00790-9

Google Scholar

[16] P.M. Hergenrother, C.M. Thompson, J.G. Smith. Flame retardant aircraft epoxy resins containing phosphorus. Polym. 2005, 46: 5012-5024.

DOI: 10.1016/j.polymer.2005.04.025

Google Scholar

[17] R. Liu, X.D. Wang. Synthesis, characterization, thermal properties and flame retardancy of a novel nonflammable phosphazene-based epoxy resin. Polym. Degrad. Stab. 2009, 94: 617-624.

DOI: 10.1016/j.polymdegradstab.2009.01.008

Google Scholar

[18] L. Li, J.L. Tian. Synthesize Hydantoin Epoxy and Peparation cured hydantoin epoxy/HHPA Mater. Eng. 2012, (3): 52-55.

Google Scholar

[19] Z.F. Lan, B. Zhao, M.L. Wang. Rheological behavior of a hydantoin epoxy resin system. Develop. Appl. Mater. 2014, (1): 66-70.

Google Scholar

[20] X.Q. Dai. Flow and infiltration performance of epoxy-curing agent reactive system in fiber preforms. Changsha. 2010. 78-86.

Google Scholar