Effect of Processing Factors on the Bonding Strength of Fibrous Assembles by Dielectric Heating

Chang Whan Joo; Dong Su Park

doi:10.4028/www.scientific.net/AMR.1119.519

Paper Titles

Effect of HCl Concentration on the Phase and Microstructure of TiO₂ Film Synthesized by Low-Voltage Anodization of Titanium
p.500

Effect of Zr, Nb and Ti Additions on Injection Molded 316L Stainless Steel: Microstructural, Mechanical Properties and Corrosion Resistance
p.505

Study of Mechanical Properties of Stainless Steel Oil Spill Plate on UG Finite Element Method
p.510

Effect of Different Operating Temperatures on Mechanical Properties of Several Rolled Aluminum Alloys
p.514

Effect of Processing Factors on the Bonding Strength of Fibrous Assembles by Dielectric Heating
p.519

Research on Heavy-Duty Coating Protection System of Magnesium Alloy
p.525

Caustic Magnesia Production in Microfluid Furnace
p.529

A Numerical Study on Stir Casting Process in a Metal Matrix Composite Using CFD Approach
p.533

Performance of Mixed Cellulase-Amylase Immobilized on PSF Membrane Support via Cross-Linked with Glutaraldehyde in Enzymatic Hydrolysis
p.542

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 1119Effect of Processing Factors on the Bonding...

Effect of Processing Factors on the Bonding Strength of Fibrous Assembles by Dielectric Heating

Abstract:

In the dielectric heating by using microwave, both the interior and exterior of fiber materials can be evenly heated simultaneously. Especially, in case of heating the material of low thermal conduction by normal furnaces, thermal loss is great and it takes long time to finish the required treatment. However, if microwave is applied to fibrous materials, it can be treated rapidly. Also, application of microwave system has the results of remarkably enhancing productivity and improving working environment owing to no air pollution. Thus, in this study, the bonded polypropylene (PP) fibers and PP/PET nonwovens have prepared by dielectric heating with various organic solvents, and their morphological structures and debonding force have investigated with different treatment time.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volume 1119)

Pages:

519-524

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.1119.519

Citation:

Cite this paper

Online since:

July 2015

Authors:

Chang Whan Joo*, Dong Su Park

Keywords:

Bonding Force, Dielectric Heating, Dipole Rotation, Fibrous Assemble, Permittivity

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] C. H. Stern, J. Micro. Power and Electro. Energy, 33(4), (1998), p.207.

Google Scholar

[2] G. Levita, A. Livi, P. A. Rolla and C. Culicchi, J. of Polymer Science, B(34), (1998), p.2731.

Google Scholar

[3] P. Cassagnau and A. Michel, Polymer Engineering Sci., 34(12), (2004), p.1011.

Google Scholar

[4] P. K. Yarlagadda and T. C. Chai, J. Materials Process. Tech., 74, (1998), p.199.

Google Scholar

[5] H. Zhao, I. Turner and G. Torgovnikov, J. Micro. Power and Electro. Energy, 33(2), (1998), p.121.

Google Scholar

[6] A. Holzwarth, J. Lou, T. A. Hatton and E. Laibinis, Ind. Eng. Chem. Res., 37, (1998), p.2701.

Google Scholar

[7] Y. S. Ho and P. Schoen, J. M. Res., 11(2), (1996). p.469.

Google Scholar

[8] R. G. Carter and P. Wang, J. Micro. Power and Electro. Energy, 32(4), (2007), p.199.

Google Scholar

[9] D. Niculae and A. Mihailescu, J. Micro. Power and Electro. Energy, 32(4), (1997), p.220.

Google Scholar

[10] J. B. Wei, K. Ngo, D. A. Tucker and Z. Fathi, J. Micro. Power and Electro. Energy, 33(1), (2008), p.10.

Google Scholar