Experimental Analysis of a Vapor Chamber Applied to Thermal Management of Microelectronics

Abstract:

In this research, a vapor chamber embedded in the base of a heat sink was experimentally analyzed for the application in thermal management of microelectronics. The vapor chamber was produced by a copper and molybdenum alloy with length of 240 mm, width of 54 mm, thickness of 3 mm, and capillary structures composed by copper screen meshes. The working fluid used was de-ionized water. The pure aluminum heat sink was cooled by air forced convection and the evaporator vapor chamber was heated using an electrical resistor simulating integrated circuit power dissipation. The experimental tests were done in a suction type wind tunnel with open return for a heat load varying from 20 to 80 W and for an airflow velocity varying from 1 to 4 m/s. The experimental results showed that the considered vapor chamber worked successfully, maintaining low operating temperature.

• Periodical: Advanced Materials Research (Volumes 1120-1121)
• Pages: 1368-1372
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1120-1121.1368
• Online since: July 2015
• Authors: Daniel Henrique de Souza Obata, Thiago Antonini Alves*, Márcio Antonio Bazani, Amarildo Tabone Paschoalini
• Keywords: Cu-Mo Alloy, Experimental Results, Thermal Analysis, Vapor Chamber, Water

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