Effect on Shear Strength and Hardness Properties of Tin Based Solder Alloy, Sn-50Bi, Sn-50Bi+2%TiO₂ Nanoparticles

Abstract:

Solder alloys are important joining medium widely used in the electronics industry to connect components to printed circuit board PCB. The Sn-Pb solder alloys have been the cornerstone medium used for a long time. Unfortunately, the use of Pb was banned by the European Union due to the harmful environmental and health issues with Pb. Therefore, in this study, the Sn-50Bi and Sn-50Bi+2%TiO2 nanoparticles lead-free solder alloy is investigated based on their shear strength, Vickers hardness, and melting temperature. The investigation shows that the hypo eutectic Sn-50Bi has a low melting temperature of approximately 145°C, and the 2%TiO₂ nanoparticles reinforced Sn-50Bi has a melting temperature of around 182°C, which is lower than the traditional Sn-Pb (Tm=183 °C) and Sn-Ag-Cu (Tm=227°C). Furthermore, the developed Sn-50Bi had a Vickers hardness and shear strength of 26.81 HV and 40.78 MPa respectively, higher than the other leaded and lead-free solders. However, after the reinforcement, the hardness increased by 12% (30 HV) and a slight increase of 2.5% (42.4MPa) in shear strength. Overall, the addition of the TiO₂ nanoparticles showed a clear influence on the Sn-Bi properties. The results obtained from this study seem satisfactory to the electronic industry and the environment.

• Periodical: Advanced Materials Research (Volume 1159)
• Pages: 54-59
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.1159.54
• Online since: September 2020
• Authors: Singh Amares*, Bandar Tchari
• Keywords: Shear Strength, Sn-Bi, Sn-Bi+TiO₂ Nanoparticles, Solder, Vickers Hardness

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