Improvement in Etching Factor of Micro Patterns by Controlling Residual Stress of Copper Thin Foil

Abstract:

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The effectiveness of residual stress on forming copper patterns of printed circuit board was investigated during applied thermal conditions. Generally, the electrolytic copper foil showed a compressive residual stress about -55~-60MPa as received, which easily caused to form copper patterns irregularly when the pattern was etched finely. The compressive residual stress was relaxed with applying heat-treatment for a few hours. However, we observed that the compressed residual stress of copper foil tended to be relaxed, constant, and compressed again during heat-treatment process, which is mainly considered as that the grain of copper is grown restrictively within a Cu thin foil layer. We suggested a quantitative method for controlling grain size, grain distribution and relaxing stress of copper foil, which was very helpful for increasing an etching factor to decrease pattern width.

Info:

Periodical:

Advanced Materials Research (Volumes 123-125)

Edited by:

Joong Hee Lee

Pages:

479-482

DOI:

10.4028/www.scientific.net/AMR.123-125.479

Citation:

H. S. Lee and H. J. Lee, "Improvement in Etching Factor of Micro Patterns by Controlling Residual Stress of Copper Thin Foil", Advanced Materials Research, Vols. 123-125, pp. 479-482, 2010

Online since:

August 2010

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Price:

$35.00

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