Improvement in Etching Factor of Micro Patterns by Controlling Residual Stress of Copper Thin Foil

Hyo Soo Lee; Hai Joong Lee

doi:10.4028/www.scientific.net/AMR.123-125.479

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 123-125Improvement in Etching Factor of Micro Patterns by...

Improvement in Etching Factor of Micro Patterns by Controlling Residual Stress of Copper Thin Foil

Abstract:

The effectiveness of residual stress on forming copper patterns of printed circuit board was investigated during applied thermal conditions. Generally, the electrolytic copper foil showed a compressive residual stress about -55~-60MPa as received, which easily caused to form copper patterns irregularly when the pattern was etched finely. The compressive residual stress was relaxed with applying heat-treatment for a few hours. However, we observed that the compressed residual stress of copper foil tended to be relaxed, constant, and compressed again during heat-treatment process, which is mainly considered as that the grain of copper is grown restrictively within a Cu thin foil layer. We suggested a quantitative method for controlling grain size, grain distribution and relaxing stress of copper foil, which was very helpful for increasing an etching factor to decrease pattern width.

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Periodical:

Advanced Materials Research (Volumes 123-125)

Pages:

479-482

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.123-125.479

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Online since:

August 2010

Authors:

Hyo Soo Lee, Hai Joong Lee

Keywords:

CCL, Etching Factor, Heat Treatment, Subtractive Process

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References

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