Investigation of Grinding Process Simulation

Abstract:

Computer simulation is an important method to research the grinding mechanism and optimize the grinding process parameters. Especially in recent years as the development of computer calculation speed, the improvement of computer graphics theory and the gradual maturity of artificial intelligence technology, experts and scholars whose research subject related grinding had done a lot of work on grinding simulation. This paper describes the main contents grinding of the grinding simulation research work made in recent years. Include some of the key research results of the present grinding simulation, the major difficulties in grinding simulation and the research trends are summarized in this paper.

• Periodical: Advanced Materials Research (Volumes 126-128)
• Pages: 119-124
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.126-128.119
• Online since: August 2010
• Authors: Tian Biao Yu, Jing Qiang Zhang, Peng Guan, Wan Shan Wang
• Keywords: Grinding, Process Parameter, Simulation, Wheel Topography

References

[1] R.M. Baul, R. Shilton: Proc. 8th Int. MTDR Conf Vol. 8 (1967), p.923.

[2] T. Suto, T. Sata: Journal of the Japan Society of Precision Engineering Vol. 45 (1979), p.554.

[3] T. Suto, T. Sata: Bulletin of the Japan Society of Precision Engineering Vol. 15(1981), p.27.

[4] K. Steffens, W. Konig: Ann CIRP Vol. 32(1983), p.255.

[5] P. Koshy, J.K. Jain and G.K. Lal: International Journal of Machine Tools and Manufacture Vol. 37 (1997), p.751.

[6] J.B. Hegeman: Fundamentals of Grinding: Surface Conditions of Ground Materials (Ph.D. University of Groningen, Netherlands 2000).

[7] X. Chenand, W, B, Rowe: International Journal of Machine Tools and Manufacture Vol. 36 (1996), p.871.

[8] Zhong Shao: Virtual Technology Application in Grinding (Dissertation Northeastern University, Shenyang 2002).

[9] Gong Yadong, Shao Zhong and Wang Wanshan: Machinery Design & Manufacture Vol. 6 (2002), p.18.

[10] W. Cooper, A.S. Lavine: Journal of Manufacturing Science and Engineering Vol. 122 (2000), p.59.

[11] T.A. Nguyen, D.L. Butler: International Journal of Machine Tools & Manufacture Vol. 45 (2005), p.1321.

[12] T.J. Chuang, Z.D. Wang, M. Hill and G. White: Fracture Mechanics of Ceramics-Fatigue, Composites, and High-Temperature Behavior Vol. 12 (1996), p.135.

[13] Amit M. Wani, Vinod Yadava and Atul Khatri: Journal of Materials Processing Technology Vol. 1-3 (2007), p.282.

[14] Su Chong: Research on Key Theories and Technologies of Virtual Grinding (Ph.D. Northeastern University, Shenyang 2009).

[15] I.F. Stowers, R. Komanduri and E.D. Baird. Proceeding of the SPIE, San Diego Vol. 966 (1989), p.62.

[16] I.F. Belak, W.G. Hoove, C.G. Hoover, et al.: Thrust Area Reps Vol. 89 (1990), p.4.

[17] J. Belak, D.B. Boercker and Stower : MRS Bulletin Vol. 18 (1993), p.55.

[18] J. Belak, J.N. Glosli, D.B. Boercker and I.F. Stower: Mat. Res. Soc. Symp Vol. 389 (1995), p.181.

[19] N. Ikawa, S. Shinada, and H. Tanaka: Nanotechnology Vol. 3 (1992), p.6.

[20] T. Inamura, H. Suzuki and N. Takezawa: Journal of the Japan Society of Precision Engineering Vol. 56 (1990), p.1480.

[21] Rudiger Rentsch, Lchiro Lnasaki: Annals of the CIRP Vol. 44 (1995), p.295.

[22] Shimizu Jun, Zhou Libo and EDA Hiroshi: Proceedings of the 10th International Manufacturing Conference Paper Vol. 10 (2002), p.8.

[23] Lin Bin, HAN Xuesong, Yu Siyuan and Chen Xi rang: Journal of Tianjing University (Science and Technology) Vol. 33 (2000), p.652.

[24] Lin Bin, Wu Hui, Yu Siyuan and Xu Yanshen: Nanotechnology and Precision Engineering Vol. 2 (2004), p.136.

[25] Guo Xiaoguang, Guo Dongming, Kang Renke and Jin Zhuji: Journal of Semiconductors Vol. 29 (2008), p.1180.