Analysis of Roughness in Super-High Speed Point Grinding

Yue Ming Liu; Ya Dong Gong; Jun Cheng; Ting Chao Han

doi:10.4028/www.scientific.net/AMR.126-128.101

Paper Titles

Research on Machining Simulation of Ultra High-Speed Grinding Machine Tool Based on Web
p.77

Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad
p.82

Grinding Characteristic Research of High Efficiency Deep Grinding for Viscous Material
p.88

A Simulation System for Grinding Based on Virtual Reality
p.96

Analysis of Roughness in Super-High Speed Point Grinding
p.101

Grinding Performance of a Grain-Arranged Diamond Wheel against Aluminum Alloys and Ti6Al4V
p.107

Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel
p.113

Investigation of Grinding Process Simulation
p.119

Fabrication of a Spherical Silicon Solar Cell Module
p.125

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 126-128Analysis of Roughness in Super-High Speed Point...

Analysis of Roughness in Super-High Speed Point Grinding

Abstract:

The technology of super-high speed point (SHSP) grinding will bring in higher precision and productivity for component manufacturing. The surface roughness attained by SHSP grinding is analyzed in this paper based on the contact area and the probability distribution of chip thickness while the swivel angle of α exists, proposing a new method to predicate the value of the roughness, the experiment of SHSP grinding is carried out whether α exists or not to verify the theoretical analysis in the paper, through observing the micro-surface after grinding, the conclusions will be drawn at last.