Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad

Abstract:

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The polishing pad plays a significant role in the Chemical Mechanical Polishing (CMP) process and its wear influences the surface accuracy of the polished wafer. A new polishing pad wear model is introduced and the law of pad wear along the pad radius is discussed, thus a new FAP with optimized pattern is designed and prepared in order. The flatness of the wafer lapped with a uniform pattern pad and that with an optimized pattern was compared. Results show that the PV value of the latter is lower that of the former.

Info:

Periodical:

Advanced Materials Research (Volumes 126-128)

Edited by:

Yunn-Shiuan Liao, Chao-Chang A. Chen, Choung-Lii Chao and Pei-Lum Tso

Pages:

82-87

DOI:

10.4028/www.scientific.net/AMR.126-128.82

Citation:

M. Li et al., "Wear of Polishing Pad and Pattern Optimization of Fixed Abrasive Pad", Advanced Materials Research, Vols. 126-128, pp. 82-87, 2010

Online since:

August 2010

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Price:

$35.00

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