Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding

Akihiko Kubo; Junichi Tamaki; A.M.M. Sharif Ullah

doi:10.4028/www.scientific.net/AMR.126-128.579

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 126-128Effect of Wheel Arrangement on Ground Surface...

Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding

Abstract:

Two grinding methods, parallel grinding and cross grinding, were applied to the horizontal-axis-type rotary surface grinding of silicon and tungsten carbide. It was found that the cross grinding method results in better ground surface roughness than parallel grinding for the silicon wafer and that an isotropic ground surface topography is achieved for both silicon and tungsten carbide by cross grinding.

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Periodical:

Advanced Materials Research (Volumes 126-128)

Pages:

579-584

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.126-128.579

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Online since:

August 2010

Authors:

Akihiko Kubo, Junichi Tamaki, A.M.M. Sharif Ullah

Keywords:

Cross Grinding, Ground Surface Topography, Horizontal-Axis-Type Rotary Surface Grinding, Parallel Grinding, Silicon Wafer, Tungsten Carbide

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References

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