Abrasive Wear Caused by EMC Particles

Yow Ching Liaw; Jung Hua Chou

doi:10.4028/www.scientific.net/AMR.126-128.559

Paper Titles

Gear Finishing and Modification Compound Process by Pulse Electrochemical Finishing with a Moving Cathode
p.533

A New Polishing Pad of EVA-Adhesive-Dressed-with-SiC-Grits Polishing Face and its Applications in Silicon Wafer Polishing
p.539

Mathematical Modeling of Electrochemical Deburring
p.545

Study on Precision Polishing of a Mini Roller Mold
p.551

Abrasive Wear Caused by EMC Particles
p.559

Numerical Simulation on Two-Step Isothermal Glass Lens Molding
p.564

Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire – Wear Behaviors of Resin Bond Diamond Wheel
p.573

Effect of Wheel Arrangement on Ground Surface Topography in Horizontal-Axis-Type Rotary Surface Grinding
p.579

A Study of the Diamond Tools for Grinding Polycrystalline Diamond
p.585

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 126-128Abrasive Wear Caused by EMC Particles

Abrasive Wear Caused by EMC Particles

Abstract:

An experimental facility is built up to investigate the abrasive wear behavior of EMC particles. The parameters explored include particle impacting velocity and impacting angle. The results show that the erosion rate depends on both the particle impacting velocity and impacting angle. A higher velocity will cause more erosion whereas a smaller impacting angle will cause more erosion, especially at higher impacting velocities. Furthermore, the morphology of the eroded particles is irregular in shape and a smaller impacting angle will result in a larger dimension of the eroded particles.