Optimal Parameter Design in Flip Chip Micro-Machining Process for Solder Residue by Using Design of Experiments Approach

Abstract:

Since the solder residue is essential in the semiconductor manufacturing process, it has great impact on the flip chip quality considerably. This paper intends to improve the flip chip quality and try to obtain an optimal solution for the system parameters in the flip chip manufacturing process. The SMT manufacturing process is studied for discussion. The amount of solder and the size of solder are selected as the two quality properties. During the flux cleaning process, many solders are left on the passive component side. The balling might flow into the chip. It will cause the bump short in the chip which will affect the quality of the flip chip severely. In this paper, response surface method is adopted as the design of experiments. The objective function and subjective constrained conditions are defined to formulate the optimization problem. The confirmation experimental results are also provided to prove the validity. It is believed that the optimization results are helpful to the improvement of the semiconductor manufacturing process.

• Periodical: Advanced Materials Research (Volumes 126-128)
• Pages: 867-872
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.126-128.867
• Online since: August 2010
• Authors: Jian Long Kuo, Chun Cheng Kuo
• Keywords: Design of Experiments (DOE) Method, Response Surface Method (RSM), Solder Bead, Solder Residue

References

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DOI: 10.17775/cseejpes.2016.00043

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[6] John H. Lau, Express packaging system, Low cost Flip Chip technologies for DCA, WLSP and PBGA assemblies, 2000. Table 2 Combinational array in response surface method Pad type Opening shape Opening gap Powder size Quantity Size.

[1] 0 0 0. 3 25 39 150.

[2] 0 -1 0. 375 45 29 100.

[3] 1 1 0. 375 35 31 100.

[4] 0 1 0. 375 45 29 100.

[5] 1 0 0. 375 25 34 125.

[6] 0 1 0. 45 35 22 50.

[7] -1 1 0. 375 35 32 100.

[8] 0 0 0. 3 45 31 100.

[9] 0 0 0. 375 35 24 75.

[10] 0 0 0. 375 35 24 75.

[11] 1 0 0. 3 35 32 100.

[12] -1 0 0. 375 45 24 75.

[13] 0 -1 0. 3 35 36 125.

[14] -1 0 0. 375 25 32 100.

[15] -1 0 0. 3 35 39 150.

[16] 0 0 0. 45 25 22 50.

[17] 0 -1 0. 45 35 19 50.

[18] 1 0 0. 375 45 26 75.

[19] 0 1 0. 3 35 37 125.

[20] 0 0 0. 45 45 14 25.

[21] 1 -1 0. 375 35 31 100.

[22] 1 0 0. 45 35 15 25.

[23] -1 0 0. 45 35 14 25.

[24] -1 -1 0. 375 35 29 100.

[25] 0 0 0. 375 35 24 75.

[26] 0 1 0. 375 25 41 150.

[27] 0 -1 0. 375 25 37 125 Table 3 Confirmation experiments Pad type Opening shape Opening gap Powder size Solder residue Rework quantity Samples quantity IT U 0. 35mm 45µm 3 404 70520 IT U 0. 4mm 45µm 0 158 39594 IT U 0. 45mm 45µm 0 1163 114798.