Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant

Ming Xia Shen; Yin Xin Cui; Yao Ming Zhang

doi:10.4028/www.scientific.net/AMR.143-144.1454

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Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 143-144Influence of Submicron Alumina on Thermal...

Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant

Abstract:

An elastic co-film with excellent mechanical properties and adhesiveness, as well as good thermal conductivity, was fabricated based on the composition of a thermal-conductive alumina and ethylene vinyl acetate (EVA) copolymer. Thermal conductivity of the co-films with various particle sizes, amount, surface properties, and so on of alumina were investigated by the laser scattering method. The SEM results showed that the co-film with 16% (volume fractions) of submicron alumina in EVA copolymer had a good interface binding.

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Periodical:

Advanced Materials Research (Volumes 143-144)

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1454-1458

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.143-144.1454

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Online since:

October 2010

Authors:

Ming Xia Shen, Yin Xin Cui, Yao Ming Zhang

Keywords:

Capsulation, EVA, Solar, Submicron Alumina, Thermal Conductivity (TC)

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