Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant
An elastic co-film with excellent mechanical properties and adhesiveness, as well as good thermal conductivity, was fabricated based on the composition of a thermal-conductive alumina and ethylene vinyl acetate (EVA) copolymer. Thermal conductivity of the co-films with various particle sizes, amount, surface properties, and so on of alumina were investigated by the laser scattering method. The SEM results showed that the co-film with 16% (volume fractions) of submicron alumina in EVA copolymer had a good interface binding.
H. Wang, B.J. Zhang, X.Z. Liu, D.Z. Luo, S.B. Zhong
M. X. Shen et al., "Influence of Submicron Alumina on Thermal Conductivity of the Filled EVA Encapsulant", Advanced Materials Research, Vols. 143-144, pp. 1454-1458, 2011