Temperature Profile of Microencapsulation for Self-Healing Application

Ting Ting Li; Xing Liu; Rui Wang

doi:10.4028/www.scientific.net/AMR.143-144.353

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 143-144Temperature Profile of Microencapsulation for...

Temperature Profile of Microencapsulation for Self-Healing Application

Abstract:

Healing agents significantly affect the efficiency of healing microcracks, which produced from life-time service in composites. And microencapsulating 5-ethylidene-2-norbornene (ENB) with Melamine-Urea-Formaldehyde (MUF) shell possessing higher self-healing efficiency is sensitive to the manufacture temperature profile which is difficult to control but crucial to the microcapsule performance and thus the reproducibility. In this paper, we studied the relationship between heating curve (rate, steps and time) and microcapsule performance (surface morphology, thermal stability and shell thickness). It shows that fast-slower heating stage produces the best quality of microcapsule with proper outer and inner surface which can endure 285°C, and the particle size is about 100m with 400-700nm shell thickness.