Effects of Anions on Corrosion Behavior of Ni-Cu-P Coatings

Abstract:

Ni-Cu-P coating was synthesized on copper substrate by electroless plating technique. The coating composition and corrosion resistance of Ni-Cu-P coating were characterized using energy-dispersive X-ray (EDX), electron probe micro-analyzer (EPMA), polarization curve (PC) and electrochemical impedance spectrum (EIS). The results show that the chemical nature of anions plays very important roles in the corrosion behavior of Ni-Cu-P coating. At a higher electrolyte concentration, Cl- and SO4 2- ions tend to promote the dissolution rate of Ni by their adsorption, while at lower electrolyte concentrations, NO3 - ions tend to dominate the dissolution rate of Ni-Cu-P coating.

• Periodical: Advanced Materials Research (Volumes 146-147)
• Pages: 1375-1378
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.146-147.1375
• Online since: October 2010
• Authors: Chong Yang Liu, Gui Chang Liu, Sui Lin Wang, Li Da Wang
• Keywords: Corrosion Resistance, Electroless Plating (EP), Ni-Cu-P Coating, Passivation

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