Preparation and Property of SnXCuNiBi Solder Alloy

Hai Yan Chen; Xiao Hua Jie; Hai Yan Zhang; Yu Long Chen; Li Guo

doi:10.4028/www.scientific.net/AMR.146-147.485

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Reaction Synthesis and Oxidation Behaviours of Ludwigite
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Effects of Ce Addition on the Mobility and Hot Tearing Tendency of Al-4.5Cu Alloy
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Preparation and Property of SnXCuNiBi Solder Alloy
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Recent Development in Multiscale Simulation of Mechanical Properties at Material Interface
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Analysis Methods for the Tensile Behaviors of Woven Membrane Materials
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Preparation of Ceramic Moulds with Zirconia Coatings for the Investment Casting of TiAl Alloys
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Influences of Temperature on the Performance of Polypropylene Woven Geotextiles
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 146-147Preparation and Property of SnXCuNiBi Solder Alloy

Preparation and Property of SnXCuNiBi Solder Alloy

Abstract:

Lead-free solder is meeting the requirement of environmental protection, but the property performance of existing lead-free solder is hardly comparable to those of lead solder. In this paper, 0.6% Bi was added into SnXCuNi solder alloy to produce lead-free solder at low cost and high performance. Microstructure, phase composition, melting point, wettability and characteristics of weld interface have been studied and analyzed. The results show that SnXCuNiBi solder alloy are mainly composed of βSn, SnX, Cu6Sn5 and SnBi. The addition of Bi reduces the melting point and improves the wettability of the solder. The main component of the joint interface of SnXCuNiBi/Cu system is Cu6Sn5, which has shown the capability to keep relatively high shear strength at the joint interface.