The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging

Abstract:

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The possible source of die edge cracking for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) models were used to analyze the effect of underfill fillet geometry on interfacial stresses between die edge and the underfill fillet. The input parameters of FC-CBGA from industry was used for simulation and the properties of commercial underfill were extracted by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA). Die stress distribution for different fillet height were generated to depict variation of stress due thermal loading. The variation of tensile stress due different fillet height and width were discussed for parameters optimization.

Info:

Periodical:

Advanced Materials Research (Volumes 148-149)

Edited by:

Xianghua Liu, Zhengyi Jiang and Jingtao Han

Pages:

1108-1111

DOI:

10.4028/www.scientific.net/AMR.148-149.1108

Citation:

A. Jalar et al., "The Effect of Underfill Fillet Geometry to Die Edge Stress for Flip Chip Packaging", Advanced Materials Research, Vols. 148-149, pp. 1108-1111, 2011

Online since:

October 2010

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Price:

$35.00

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