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Fabrication and Research of Electroless Nickel Plating on Carbon Fiber with Palladium-Free Activation

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Abstract:

A new procedure of surface activation without using palladium salt is proposed for electroless nickel plating (Ni-P) on carbon fiber. The optimal formula and technical conditions for palladium-free activated electroless Ni-P were obtained by orthogonal experiments. The effects of nitric acid processing time on the quality of nickel coating was investigated .The effects of varying concentrations of Ni2 + on the rate of weight gain during the Ni2 + complex adsorption process were also analyzed and the kinetic equation of the process was established. The theoretical values calculated by the equation were proven to be consistent with the experimental verification. The material characteristics of the deposited layers were analyzed by scanning electron microscopy (SEM), energy-dispersive x-ray spectroscopy (EDX) and X-ray diffraction (XRD). The tensile strength of the carbon fibers was analyzed by the Weibull method, and this showed that when the thickness of the Ni-P coating reached 0.150μm, the tensile strength reached a maximum value. The experimental results showed that the nickel deposition on the carbon fiber surface obtained by this method, had the same uniformity, compactness and adhesive properties as the one by conventional electroless Ni-P.

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Periodical:

Advanced Materials Research (Volumes 148-149)

Pages:

410-415

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.148-149.410

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Online since:

October 2010

Authors:

Xiao Ping Luo, Ming Gang Zhang, Chun Xiang Lv

Keywords:

Carbon Fiber (CF), Electroless Ni-P Plating, Pd Free Activation, Surface Treatment

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] Michael D Cole. Explosive Demand for Carbon Fiber Expected to Continue[J]. International Fiber Journal, 2007(4): 62—63.

Google Scholar

[2] Cfisfina Elizetexa．Recovery and Re-use of Carbon Fiber[J]. JEC Composites Magazine, 2006, 26(7): 58—60.

Google Scholar

[3] SUN Yue, WAN Xi—wei, JIANG Jiu—ximg, HE Xiao—dong. Study on Technique of Pretreatment for Electroless Nickel Plating on Carbon Fiber [J] China Surface Engineering, 2007, 20(5): 41-45.

Google Scholar

[4] GAO Song, YAO Guang-chun. Short carbon fiber reinforced aluminum matrix composites[J]. Journal of Chemical Industry and Engineering, 2007, 56(6): 1130-1133.

Google Scholar

[5] HAN Bian-hua, LUO Tian-jiao, LIANG Chun-lin, et al. Carbon Fiber with Ni-coating Reinforced Aluminum Matrix Composites[J]. Materials Review, 2006, 20: 447-450.

Google Scholar

[6] HAN Bian-hua, LUO Tian-jiao, YAO Guang-chun. Nickel plating on carbon fiber[J]. Non-ferrous mining and metallurgy, 2006, 22: 37-40.

Google Scholar

[7] WANG Sen-lin, WU Hui-huang. Electroless nickel plating on glass substrate by palladium-free activation[J]. Chinese Journal of Applied Chemistry, 2003, 20(5): 491-493.

Google Scholar

[8] Tang X J. Cao M. Bi C L. Research on a New Surface Activation Process for Electroless Plating on ABS[J]. Plastic, (2007).

Google Scholar