Effect of Technological Parameters on the Profile Extrusion Process

Hong Yan

doi:10.4028/www.scientific.net/AMR.15-17.627

Paper Titles

Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple
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Effects of Constitutive Parameters on Thickness of Phase Transformed Adiabatic Shear Band for Ductile Metal Based on Johnson-Cook and Gradient Plasticity Models
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Evolution of Interphase Stress in Zr-2.5%Nb during Deformation
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Microstructures of Rapidly Solidified Pb-Sb-Sn-Alloys
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Effect of Technological Parameters on the Profile Extrusion Process
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Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing
p.633

Crystal-Grain Refinement of Materials under an Ultra-Strong Gravitational Field
p.639

On the Physical Meaning of the Hall-Petch Constant
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Microstructural Evolution and Recrystallization Behavior in Copper Multi-Directionally Forged at 77 K
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 15-17Effect of Technological Parameters on the Profile...

Effect of Technological Parameters on the Profile Extrusion Process

Abstract:

The non-homogeneous metal flow during the extrusion process is well controlled by introducing a reflecting non-equilibrium parameter of metal flow —— the mean-square deviation of velocity ( SDV ) in this paper. The finite deformation elastoplastic finite element method is used to carry out the numerical simulation research on the profile extrusion process with the different extrusion parameters (such as extrusion ratio, frictional factor). The varied laws of the extrusion pressure, SDV and stress-strain fields with the extrusion parameters are obtained. It is a theoretic consideration to optimize the technological parameters in the profile extrusion process.

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Periodical:

Advanced Materials Research (Volumes 15-17)

Pages:

627-632

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.15-17.627

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Online since:

February 2006

Authors:

Hong Yan

Keywords:

Elasto-Plastic Finite Element Method, Profile Extrusion, SDV, Technological Parameter

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