Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple

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Periodical:

Advanced Materials Research (Volumes 15-17)

Edited by:

T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran

Pages:

604-608

DOI:

10.4028/www.scientific.net/AMR.15-17.604

Citation:

J.B. Ryu et al., "Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple", Advanced Materials Research, Vols. 15-17, pp. 604-608, 2007

Online since:

February 2006

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$35.00

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