Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple

J.B. Ryu; Joo Youl Huh; H.S. Kim; Seong Ju Oh

doi:10.4028/www.scientific.net/AMR.15-17.604

Paper Titles

Preparation of Size and Aggregation Controlled Nickel Oxalate Dihydrate Particles from Nickel Hydroxide
p.581

Thermoelectric Properties of Ni-Doped CoSb₃ Prepared by Encapsulated Induction Melting
p.587

A Study on the Fabrication of Metal Fiber by Fine Melt Extraction Process
p.592

Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits
p.599

Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple
p.604

Effects of Constitutive Parameters on Thickness of Phase Transformed Adiabatic Shear Band for Ductile Metal Based on Johnson-Cook and Gradient Plasticity Models
p.609

Evolution of Interphase Stress in Zr-2.5%Nb during Deformation
p.615

Microstructures of Rapidly Solidified Pb-Sb-Sn-Alloys
p.621

Effect of Technological Parameters on the Profile Extrusion Process
p.627

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Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple

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Periodical:

Advanced Materials Research (Volumes 15-17)

Pages:

604-608

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.15-17.604

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Online since:

February 2006

Authors:

J.B. Ryu, Joo Youl Huh, H.S. Kim, Seong Ju Oh

Keywords:

BGA Package, Solder Joint, Solid State Diffusion, Surface Finish, Ternary Intermetallic Compound

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