Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits

Hiroyuki Saiki; Yasuo Marumo; Hiroshi Nishitake; Masahiro Hazama; Fuminori Sakata

doi:10.4028/www.scientific.net/AMR.15-17.599

Paper Titles

Microstructure and Mechanical Properties of Solid-Phase Sintered Heavy Tungsten Alloy
p.575

Preparation of Size and Aggregation Controlled Nickel Oxalate Dihydrate Particles from Nickel Hydroxide
p.581

Thermoelectric Properties of Ni-Doped CoSb₃ Prepared by Encapsulated Induction Melting
p.587

A Study on the Fabrication of Metal Fiber by Fine Melt Extraction Process
p.592

Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits
p.599

Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple
p.604

Effects of Constitutive Parameters on Thickness of Phase Transformed Adiabatic Shear Band for Ductile Metal Based on Johnson-Cook and Gradient Plasticity Models
p.609

Evolution of Interphase Stress in Zr-2.5%Nb during Deformation
p.615

Microstructures of Rapidly Solidified Pb-Sb-Sn-Alloys
p.621

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 15-17Deformation Characteristics of Epoxy Compounds for...

Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits

Abstract:

Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 15-17)

Pages:

599-603

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.15-17.599

Citation:

Cite this paper

Online since:

February 2006

Authors:

Hiroyuki Saiki, Yasuo Marumo, Hiroshi Nishitake, Masahiro Hazama, Fuminori Sakata

Keywords:

Deformation Characteristic, Epoxy Moulding Compound (EMC), IC Package

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] O. Slattery, T. Hayes, W. Lawton, G. Kelly, C. Lyden, J. Barrett, C. O'Mathuna, Journal of Materials Processing Technology, 54(1995)199-204.

DOI: 10.1016/0924-0136(95)01942-1

Google Scholar

[2] L.J. Ernst, G.Q. Zhang, K.M.B. Jansen, H.J.L. Bressers, Trans. ASME, Journal of Electronic Packaging, 125(2003), 539-548.

Google Scholar

[3] J.H.L. Pang, T.I. Tan, Y.R. Chong, G.Y. Lim, C.L. Wong, Journal of Electron. Manufact., 8(1998)181-191.

Google Scholar

[4] S. Nakamura, Y. Miyano, S. Sugimori, A. Kaneda, JSME Int. J. Ser. 1, 31(1998)126-131.

Google Scholar

[5] S. Yi, K.Y. Sze, Trans. ASME, Journal of Electronic Packaging, 120(1998) 385-390.

Google Scholar

[6] M. Amagi, H. Seno, K Ebe, IEEE Trans. on Compornents, Packaging and Manufacturing Technology -PartB, 18-1(1995)119-126.

Google Scholar

[7] S. Yi, H. Hilton, M.F. Ahmad, Mechanics of Composite Materials Structures, 5(1998)81-101.

Google Scholar

[8] S. Yi, J. Goh, J.C. Yang, IEEE Trans. on Compornents, Packaging and Manufacturing Technology -PartB, 18-1(1997)247-225.

Google Scholar

[9] H. Miura, M. Kitano, A. Nishimura, S. Kawai, Trans. ASME, Journal of Electronic Packaging, 115(1993)9-15.

Google Scholar

[10] W.D. van Driel, J.H.J. Janssen, G.Q. Zhang, D.G. Yang, L.J. Ernst, Trans. ASME, Journal of Electronic Packaging, 125(2003)520-526.

Google Scholar

[11] K. Cho, I. Jeon, Microelectronics Reliability, 44(2004)621-626.

Google Scholar

[12] K. Miyake, T. Yoshida, H.G. Baik, S.W. Park, Trans. ASME, Journal of Electornic Pachaging, 123(2001)101-104.

Google Scholar

[13] T.S. Dickson, M.F. Matthew, 123(2001)268-272.

Google Scholar

[14] H. Saiki, H. Nishitake, Y. Marumo, and H. Sakamoto, Trans. JSME (A), 56-525 (1990) 1311-1317.

Google Scholar

[15] Y. Parton, I. Schanin, Polymer Engng. and Science, 23-15 (1983) 849-859.

Google Scholar

[16] E. W. Hart, Trans. ASME, J. of Engng. Materials and Technology, 93-3 (1976), 193-202. Fig . 6 Visco-elastic-plastic model Fig . 7 Comparison of stress-strain curves obtained from the tensile test and the evaluation using the model.

Google Scholar