Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits

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Tensile tests of epoxy molding compounds were carried out using specimens composed of epoxy molding compounds which are transfer molded and post cured. The mechanical characteristics of the epoxy molding compounds change significantly due to changes in temperature and strain rate. In addition, the effect of nonlinear viscosity is large in both elastic and plastic regions. The characteristics of the visco-elastic-plastic behaviors of the epoxy molding compounds were examined. The behavior characteristics of the epoxy molding compounds during loading and unloading were shown in detail.

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Periodical:

Advanced Materials Research (Volumes 15-17)

Edited by:

T. Chandra, K. Tsuzaki, M. Militzer and C. Ravindran

Pages:

599-603

Citation:

H. Saiki et al., "Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits", Advanced Materials Research, Vols. 15-17, pp. 599-603, 2007

Online since:

February 2006

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$38.00

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