Thermoelectric Properties of Ni-Doped CoSb3 Prepared by Encapsulated Induction Melting

Il Ho Kim; Mi Jung Kim; Hyun Mo Choi; Sin Wook You; Kyung Wook Jang; Jung Il Lee; Soon Chul Ur

doi:10.4028/www.scientific.net/AMR.15-17.587

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Thermal Stability of Nano Grain Structure Tungsten Prepared by SPD-PM Process
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Microstructure and Mechanical Properties of Solid-Phase Sintered Heavy Tungsten Alloy
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Preparation of Size and Aggregation Controlled Nickel Oxalate Dihydrate Particles from Nickel Hydroxide
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Thermoelectric Properties of Ni-Doped CoSb₃ Prepared by Encapsulated Induction Melting
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A Study on the Fabrication of Metal Fiber by Fine Melt Extraction Process
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Deformation Characteristics of Epoxy Compounds for Semiconductor Integrated Circuits
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Solid-State Interaction between Ni and Cu for Ternary Compound Growth in Ni/Sn/Cu Diffusion Couple
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Effects of Constitutive Parameters on Thickness of Phase Transformed Adiabatic Shear Band for Ductile Metal Based on Johnson-Cook and Gradient Plasticity Models
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Thermoelectric Properties of Ni-Doped CoSb₃ Prepared by Encapsulated Induction Melting

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Advanced Materials Research (Volumes 15-17)

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587-591

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https://doi.org/10.4028/www.scientific.net/AMR.15-17.587

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Online since:

February 2006

Authors:

Il Ho Kim, Mi Jung Kim, Hyun Mo Choi, Sin Wook You, Kyung Wook Jang, Jung Il Lee, Soon Chul Ur

Keywords:

Doping, Induction Melting, Skutterudite, Thermoelectric

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