Thermal Conductive Composite Prepared by Carbon Coated Aluminum Nanoparticles Filled Silicone Rubber

Abstract:

With methyl vinyl silicone (MVQ) as the base rubber, filled with self-synthesized carbon coated aluminum nanoparticles, the high thermal conductive composite was prepared by using the method of mechanical blending. The effect of carbon coated aluminum nanoparticles on thermal conductivity and coefficient of thermal expansion (CTE) of the silicone rubber were investigated, and it was found that thermal conductivity of the composite increased with increasing carbon coated aluminum nanoparticles content during the process of thermal conductive network initially formed to throughout the whole composite, the thermal conductivity began to decrease when the filling content reached 250phr,the optimum filling amount of carbon coated nanoparticles was 250phr.The Y-Agrai model was employed to investigate the thermal conductivity of the thermal conductive composite, results indicated that when the filling content was less than 200phr,theoretical value was coincided with measured value. While the filling content was more than 200phr, theoretical value was gradually less than measured value. While the carbon coated aluminum nanoparticles content increased, the coefficient of thermal expansion (CTE) of composite decreased significantly.

• Periodical: Advanced Materials Research (Volumes 150-151)
• Pages: 464-469
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.150-151.464
• Online since: October 2010
• Authors: Hai Yan Zhang, Jin Lin, Hao Qun Hong
• Keywords: Carbon Coated Aluminum Nanoparticles, CTE, Thermal Conductive Composite, Thermal Conductivity (TC), Thermal Interface Material

References

[1] D D L Chung: Applied Thermal Engineering . Vol. 21(2001), pp.1593-1605.

[2] Prasher: Proc IEEE . Vol. 94(2006), pp.1571-1586.

[3] Howe TA, Leong CK, Chung D D L: Electron Mater. Vol. 35(2006), pp.1628-1635.

[4] Liu ZR, Chung D D L: Thermochimica Acta . Vol. 366(2001), pp.135-147.

[5] L C Sim, S R Ramanan, H Ismail, K N Seetharamu, T J Goh: Thermochimica Acta. Vol. 430(2005), pp.155-165.

DOI: 10.1016/j.tca.2004.12.024

[6] Hu Zhou, Shimin Zhang, Mingshu Yang: Composites Science and Technology. Vol. 67(2007), pp.1035-1040.

[7] G De Mey, J Pilarski, M Wójcik, M Lasota, J Banaszczyk, B Vermeersch, A Napieralski: International Communications in Heat and Mass Transfer. Vol. 36(2009), pp.210-212.

DOI: 10.1016/j.icheatmasstransfer.2008.10.016

[8] WU Min-juan, ZHOU Ling-juan, JIANG Guo-dong, WANG Ting-wei: SILICONE MATERIAL. Vol. 20(2)(2006), pp.81-85. In Chinese.

[9] Ravi Prasher: International Journal of Heat and Mass Transfer. Vol. 48(2005), pp.4942-4952.

[10] J P Gwinn, R L Webb: Microelectronics Journal. Vol. 34 (2003), pp.215-222.

[11] Chen X B: Acta Materiac composite Sinica. Vol. 13(4)1996, pp.1-7.

[12] Jinho Hong, Jeongwoo Lee, Chang Kook Hong, Sang Eun Shim: Current Applied Physics. Vol. 10 (2010), pp.359-363.

[13] Agari Y, Ueda A, Nagai S: Journal of Applied Polymer Science. Vol. 42 (1991), pp.1665-1669.