Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography

Cai Ping Liu; Qing Quan Duan; Ling Tao Mao

doi:10.4028/www.scientific.net/AMR.152-153.1004

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 152-153Ductile Damage Evolution Analysis of Lead-Free...

Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography

Abstract:

Meso topography is used to examine the damage degree of lead-free Sn-Zn solder. Real-time meso topography is observed using scanning electronic microscope(SEM), which is assembled in a loading machine. The solder’s deformation and fracture is simulated using a damage accumulation process. The observed meso-structure evolutionary processes of the solder material is then analyzed according to the macro-meso combined mechanism. Some image processing technique are used. A new model of fracture mechanism and degree of damage is proposed.. that We show that the proposed meso structure evolution equations can accurately model the degree of material damage.

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Periodical:

Advanced Materials Research (Volumes 152-153)

Pages:

1004-1008

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.152-153.1004

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Online since:

October 2010

Authors:

Cai Ping Liu, Qing Quan Duan, Ling Tao Mao

Keywords:

Damage Evolution, Ductile Failure, Image Processing, Lead-Free Solder, Meso-Structure

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