Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography

Abstract:

Article Preview

Meso topography is used to examine the damage degree of lead-free Sn-Zn solder. Real-time meso topography is observed using scanning electronic microscope(SEM), which is assembled in a loading machine. The solder’s deformation and fracture is simulated using a damage accumulation process. The observed meso-structure evolutionary processes of the solder material is then analyzed according to the macro-meso combined mechanism. Some image processing technique are used. A new model of fracture mechanism and degree of damage is proposed.. that We show that the proposed meso structure evolution equations can accurately model the degree of material damage.

Info:

Periodical:

Advanced Materials Research (Volumes 152-153)

Edited by:

Zhengyi Jiang, Jingtao Han and Xianghua Liu

Pages:

1004-1008

DOI:

10.4028/www.scientific.net/AMR.152-153.1004

Citation:

C. P. Liu et al., "Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography", Advanced Materials Research, Vols. 152-153, pp. 1004-1008, 2011

Online since:

October 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.