Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography
Meso topography is used to examine the damage degree of lead-free Sn-Zn solder. Real-time meso topography is observed using scanning electronic microscope(SEM), which is assembled in a loading machine. The solder’s deformation and fracture is simulated using a damage accumulation process. The observed meso-structure evolutionary processes of the solder material is then analyzed according to the macro-meso combined mechanism. Some image processing technique are used. A new model of fracture mechanism and degree of damage is proposed.. that We show that the proposed meso structure evolution equations can accurately model the degree of material damage.
Zhengyi Jiang, Jingtao Han and Xianghua Liu
C. P. Liu et al., "Ductile Damage Evolution Analysis of Lead-Free Sn-Zn Solder Based on Meso Topography", Advanced Materials Research, Vols. 152-153, pp. 1004-1008, 2011