Preparation and Characterisation of an Aligned Carbon Nanotube Array on the Ni-Deposited Silicon Surface

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An aligned carbon nanotube(CNT)array has been prepared on large area Ni-deposited silicon substrates via the pyrolysis of C2H2 using thermal chemical vapor deposition technique at 900°C. Ni nanoparticles were formed when Ni catalyst film was etched and conglomerated by NH3 pretreatment. Under the experimental conditions used, scanning electron microscope (SEM) images showed the CNTs films with 3090 nm in diameter and 17 m in length grown perpendicular to the surface of the substrates at an average growth rate of 102 m/h. Energy dispersive X-ray (EDX) spectrum is carried out to identify the composition of the CNTs and EDX analysis demonstrated that the CNTs are formed as tip growth.

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Advanced Materials Research (Volumes 152-153)

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722-725

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October 2010

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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[1] S. Iijima: Nature Vol. 354 (1991), p.56.

Google Scholar

[2] H. Huang, H. Kajiura, A. Yamada andM. Ata: Chem. Phys. Lett. Vol. 356 (2002), p.567.

Google Scholar

[3] A. Thess, R. Lee, P. Nikolaev, H. Dai, P. Petit, J. Robert, C.H. Xu, Y. H. Lee, S. G. Kim, A.G. Rinzler, D.T. Colbert, G.E. Scuseria, D. Tománek, J. E. Fischer and R.E. Smalley: Science Vol. 273 (1996), p.483.

DOI: 10.1126/science.273.5274.483

Google Scholar

[4] H.P. Liu, G.A. Cheng, Y. Zhao, R.T. Zheng, C.L. Liang, F. Zhao and T.H. Zhang: Surf. Coat. Techn. Vol. 201 (2006), p.938.

Google Scholar

[5] K. Kempa, B. Kimball, J. Rybczynski and Z.P. Huang, P. F. Wu: Nano. Lett. Vol. 3 (2003), p.13.

Google Scholar

[6] Z.P. Huang, D.L. Carnahan, J. Rybczynski, M. Giersig, M. Sennett, D.Z. Wang, J.G. Wen, K. Kempa and Z.F. Ren: Appl. Phys. Lett. Vol. 82 (2003), p.460.

DOI: 10.1063/1.1539299

Google Scholar

[7] J.S. Gao, K. Umeda, K. Uchino, H. Nakashima and K. Muraoka: Mater. Sci. Engineer Vol. A352 (2003), p.308.

Google Scholar