Nanoindentation Test for the Stiffness Distribution Analysis of Bonded Au Ball Bonds

Abstract:

The Reduced Modulus value for the bonded Au ball bond that have undergone three different time intervals of high temperature storage (HTS) have been obtained by using nanoindentation test. Twelve indentations have been made at three different locations (Au, IMC and Si area) across the bonded ball bonds to evaluate the variation of Reduced Modulus with the location of indentation. It was shown that the Reduced Modulus value for the indentations at IMC area is increased with the increment of HTS time interval. It was also observed that the Reduced Modulus at the Au area was increased with the increment of the HTS exposure time. No particular pattern was noted to describe the changes of Reduced Modulus with the location of the indentations that have been made. It was also found that the average Reduced Modulus for Au obtained through nanoindentation with value of 107 GPa has higher value compared to that of the Young’s modulus value obtained through actual tensile test with value of 79 GPa.

• Periodical: Advanced Materials Research (Volumes 154-155)
• Pages: 674-677
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.154-155.674
• Online since: October 2010
• Authors: Norinsan Kamil Othman, Mohd Nubli Zulkifli, Azman Jalar, Shahrum Abdullah
• Keywords: High Temperature Storage, Nanoindentation, Reliability, Stiffness, Wire Bonding

References

[1] C. D. Breach, and F. W. Wulff: Journal of Microelectronics Reliability, Vol. 50 (2010), p.1.

[2] F. F. Ling: Introduction to Contact Mechanics (Springer, New York 2000).

[3] G. M. Pharr: Journal of Materials Science and Engineering Vol. A253 (1998), p.151.

[4] J. Lian, S. J. W. Chun, M. S. Goorsky and J. Wang: Journal of Material Science Vol. 44 (2009), p.6155.

[5] K. S. Kim, J. Y. Song, E. K. Chung, J. K. Park and S. H. Hong, Relationship between mechanical properties and microstructure of ultra-fine gold bonding wires: Journal of Mechanics of Materials Vol. 38 (2006), p.119.

DOI: 10.1016/j.mechmat.2005.05.015

[6] J. H. Cho, J. S. Cho, J. T. Moon, J. Lee, Y. H. Cho, Y. W. Kim, A. D. Rollett and K. H. Oh: Journal of Metallurgical and Materials Transactions A Vol. 34A (2003), p.1113.

[7] M. Shah, K. Zeng, A. A. O. Tay and S. Suresh: Journal of Electronic Packaging Vol. 126 (2004), p.87.

[8] J. Seuntjens, Z. P. Lu, R. Emily, C. W. Tok, F. Wulff, S. S. Ang and S. Kumar: Proceeding of SEMICON (2001).

[9] D. J. Shuman, A. L. M. Costa and M. S. Andrade: Journal of Material Characterization Vol. 58 (2007), 380-389.