Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface

Abstract:

Article Preview

The reactions between Cu and the eutectic SnBi (Sn58wt.%Bi) solder alloy with and without 1wt.%Ni addition were investigated in this paper. After as-reflowed process, the IMCs formed in the Sn58wt.%Bi/Cu and Sn58wt.%Bi1wt.%Ni/Cu joints were Cu6Sn5 and (CuNi)6Sn5, respectively. During aging process, the thickness of the IMC layers formed at each solder/Cu joint increased, and a new layer Cu3Sn formed adjacent to the Cu substrate. It was found that 1wt.%Ni addition in Sn58wt.%Bi solder alloy could slightly enhance the growth rate of the total IMC layer, but effectively reduce the growth rate of Cu3Sn layer during aging process. The growth behavior of IMC layer for each joint followed the diffusion-controlled mechanism during aging.

Info:

Periodical:

Advanced Materials Research (Volumes 160-162)

Edited by:

Guojun Zhang and Jessica Xu

Pages:

709-714

DOI:

10.4028/www.scientific.net/AMR.160-162.709

Citation:

T. Y. Kang et al., "Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface", Advanced Materials Research, Vols. 160-162, pp. 709-714, 2011

Online since:

November 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.