Analysis of Impact on the Wafer Surface Performance of Supercritical CO2 Extraction

Ru Bing Han

doi:10.4028/www.scientific.net/AMR.160-162.704

Paper Titles

Molecular Dynamics Study of Size Effect on Uniaxial Tension of Single Crystal Cu Nanowires
p.682

Microstructure of Rapidly Solidified CuFe10 Alloys
p.687

Effect of Rare Earth on 30CrMnSi Steel Investment Castings Cracking
p.692

Influence of Segment Design of Shield Tunnel on the Magnitude of Joint Opening
p.698

Analysis of Impact on the Wafer Surface Performance of Supercritical CO₂ Extraction
p.704

Effect of Ni Addition on the Formation and Growth of Intermetallic Compound at Eutectic SnBi/Cu Interface
p.709

Application of Different Post-Treatments to Improve the Leaching Resistance of ACQ-D Treated Wood
p.715

Stress Distribution in the Vicinity of Thermally Grown Oxide of Thermal Barrier Coatings
p.721

Study on Current Imaging of Nugget in RSW Based on Magnetic Field
p.726

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 160-162Analysis of Impact on the Wafer Surface...

Analysis of Impact on the Wafer Surface Performance of Supercritical CO₂ Extraction

Abstract:

The surface of the wafer is easy to be polluted by the organic pollution material. The supercritical fluid extraction technology works well in extracting organic pollution material. Whether the extraction process influences the surface performance of the wafer can be determined through the SEM(scanning electron microscope), AFM (atomic force microscope), and XPS (X-ray photoelectron spectroscopy). Compare the feature and the electronic structure of the wafer before and after supercritical CO2 extraction to get how supercritical CO2 extraction process influences the wafer surface performance. The conclusion helps to determine whether the extraction technology can be applied in the wafer surface cleaning technology. Tests show that supercritical CO2 extraction process almost does not influence the surface performance of the wafer, and, the supercritical CO2 extraction technology has a good prospect in the wafer cleaning.

You might also be interested in these eBooks

Materials Science and Engineering Applications

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 160-162)

Pages:

704-708

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.160-162.704

Citation:

Cite this paper

Online since:

November 2010

Authors:

Ru Bing Han

Keywords:

Analysis, Extraction, Performance, Wafer

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

References

[1] Cao Bao-cheng, YU Xin-hao, MA Jin, et al Study of Silicon Wafer Cleaning Effects Using Clean Solutions Containing Surfactants and Chelates. Chinese Journal of Semiconductors. 22(2)1226-122(2001).

Google Scholar

[2] Hawthorne S B, Hegvik K M, Yang Y, et al. determination of heavy hydrocarbon contamination using supercritical fluid extraction with infrared detection. Fuel. 73(120): 1876(1994).

DOI: 10.1016/0016-2361(94)90215-1

Google Scholar

[3] Erkey C, Madras G, Orejuela M, et al. Supercritical carbon dioxide extraction of organics from soil. Environ. Sci. Techno. 27(6): 1225(1993).

DOI: 10.1021/es00043a025

Google Scholar

[4] Yan Zhirui, Developing trend of wafer clean process. Equipment for electronic products manufacturing. 116: 23-26(2004).

Google Scholar

[5] Wang Jianqi, Extended Discuss on Electronics Energy Spectra, Beijing: Publishing House of National Defense Industry. 522(1992).

Google Scholar