Computational Simulation of the Joint Shape after as-Reflowed Soldering

Ning Zhang; Li Tian; Yao Wu Shi; Jian Lin; Yong Ping Lei; Hai Yan Zhao

doi:10.4028/www.scientific.net/AMR.177.651

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 177Computational Simulation of the Joint Shape after...

Computational Simulation of the Joint Shape after as-Reflowed Soldering

Abstract:

Using the interactive software, this study was mainly focused on developing a 3-D joint shape after the as-reflowed soldering which is the one of chief factors affecting the reliability. From the results, the soldering process can be simulated and observed directly. By changing the various conditions and constraints, such as surface tension, wetting angle and specific gravity, it makes a comparison between the simulated result and the experimental one. The simulated parameters are based on those of the traditional eutectic Sn-Pb solder. After slicing and comparing the different profiles of the simulated shape, the 3-D simulated geometry fits well with the experimental one.

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Periodical:

Advanced Materials Research (Volume 177)

Pages:

651-656

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.177.651

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Online since:

December 2010

Authors:

Ning Zhang, Li Tian, Yao Wu Shi, Jian Lin, Yong Ping Lei, Hai Yan Zhao

Keywords:

3-D Shape Simulation, Eutectic Sn-Pb Solder, Solder Joint

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