Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices

Abstract:

Article Preview

Indium antimony(InSb) is one of the important materials which can be used to make semiconductor devices such as infrared detection device. Due to the low hardness and great brittleness, the surface scratching always appears and surface roughness is hard to lower during surface preparation. So it should be increasing the InSb surface quality during ultra precision machining. In this paper the InSb surface adsorption-control technology was introduced. Through controlling surface roughness during chemical mechanical polishing(CMP) and using preferential adsorption during cleaning, the adsorptions of InSb surface were controlled. Through experiments, the CMP optimal process parameters under the alkaline conditions were gotten. Under such conditions, the preferable surface state was realized. According to the preferential adsorption model, through using FA/O non-ionic surfactant the polished wafer surface can be kept in physical adsorption and easy cleaning state, so the wafer surface adsorption can be controlled effectively and the clean surface was obtained.

Info:

Periodical:

Advanced Materials Research (Volumes 183-185)

Edited by:

Yanguo Shi and Jinlong Zuo

Pages:

1137-1140

DOI:

10.4028/www.scientific.net/AMR.183-185.1137

Citation:

X. H. Niu et al., "Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices", Advanced Materials Research, Vols. 183-185, pp. 1137-1140, 2011

Online since:

January 2011

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.