Study on the Effect of Ultrasonic Waves on the Low Temperature Electroless Ni-P Plating on Copper Substrate

Abstract:

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In this paper,electroless Ni-P plating on copper substrate at 50 °C in ultrasonic field was carried out. The frequency of ultrasonic waves was 40 kHz. The effect of ultrasonic on the composition, plating rate and morphology of Ni-P deposite was investigated at the ultrasonic power of 40, 70 and 100 W. The experimental results showed Ni-P deposit could not be obtained without ultrasonic field at 50 °C. The content of nickel and the thickness of Ni-P deposit increased with the ultrasonic waves power increase. Ultrasonic irradiation power remarkably refines the nodule size of Ni-P particles. The collapse of cavities in solution seems to suppress the Z-direction growth of the nodule.

Info:

Periodical:

Advanced Materials Research (Volumes 189-193)

Edited by:

Zhengyi Jiang, Shanqing Li, Jianmin Zeng, Xiaoping Liao and Daoguo Yang

Pages:

1142-1145

DOI:

10.4028/www.scientific.net/AMR.189-193.1142

Citation:

Y. J. Hu et al., "Study on the Effect of Ultrasonic Waves on the Low Temperature Electroless Ni-P Plating on Copper Substrate", Advanced Materials Research, Vols. 189-193, pp. 1142-1145, 2011

Online since:

February 2011

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Price:

$35.00

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