Study on the Effect of Ultrasonic Waves on the Low Temperature Electroless Ni-P Plating on Copper Substrate

Abstract:

In this paper，electroless Ni-P plating on copper substrate at 50 °C in ultrasonic field was carried out. The frequency of ultrasonic waves was 40 kHz. The effect of ultrasonic on the composition, plating rate and morphology of Ni-P deposite was investigated at the ultrasonic power of 40, 70 and 100 W. The experimental results showed Ni-P deposit could not be obtained without ultrasonic field at 50 °C. The content of nickel and the thickness of Ni-P deposit increased with the ultrasonic waves power increase. Ultrasonic irradiation power remarkably refines the nodule size of Ni-P particles. The collapse of cavities in solution seems to suppress the Z-direction growth of the nodule.

• Periodical: Advanced Materials Research (Volumes 189-193)
• Pages: 1142-1145
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.189-193.1142
• Online since: February 2011
• Authors: Yong Jun Hu, Guang Hui Hu, Xiao Ling Cheng, Xiao Ting Xiao, Hai Yan Zhang, Feng Li, Qing Song Xu
• Keywords: Composition, Electroless Plating (EP), Low-Temperature, Morpholoy, Ultrasonic

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