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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 189-193Formation and Growth of Intermetallic Compound...

Formation and Growth of Intermetallic Compound Layers at Interface of Solder/Copper Alloys for Lead Frame

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Abstract:

The effect of chemical species of copper alloys on growth of intermetallic compounds (IMCs) at interface of solder/copper alloys for lead frame was investigated. The results have revealed that Cu is the main diffusing species during aging. After aged at 160°C for 300h, only a Cu₆Sn₅ IMC layer is observed at SnPb/copper alloys interfaces. The growth rate of IMC on the Cu-Cr-Zr system alloys and Cu-Ni-Si alloys was much slower than that of IMC on the C19400 alloy. The Pb phase and voids were found to be inside the Cu₆Sn₅ phase. Chromium, one of the alloying element in Cu-Cr-Zr-Zn alloys, has found to be segregated at the interface between the copper alloy/Cu₆Sn₅. Zn and Zr in the Cu-Cr-Zr-Zn system alloy are enriched in small amout inside the IMC. These observed results were discussed and analysed on the baisis of diffusion and growth kinetics.

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Periodical:

Advanced Materials Research (Volumes 189-193)

Pages:

3383-3390

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.189-193.3383

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Online since:

February 2011

Authors:

Fu Xiang Huang, Ping Yin, Chun Tian Li, Ji Chao Li

Keywords:

Aging, Copper Alloy, Interface, Intermetallic Compound (IMC), Solder

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© 2011 Trans Tech Publications Ltd. All Rights Reserved

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