Recrystallisation Behaviour of Cu-20Ni-5Sn Alloy
Investigate effects of annealing temperature and holding time on the recrystallization temperature, hardness, microstructure and average grain size of Cu-20Ni-5Sn alloy by hardness tester, microscope and XRD. Research the kinetic mechanism of grain growth of recrystallization of Cu-20Ni-5Sn alloy. The research result shows that the recrystallization temperature declines with the increase of cold-deformation. The recrystallization temperature is at about 500°C ~650°C respectively for 50% and 60% total cold deformation, and is about 470°C ~620°C respectively for 70% and 85% total deformation. The grains grow up with the increase of annealing temperature and holding time.
Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang
R. Q. Liu et al., "Recrystallisation Behaviour of Cu-20Ni-5Sn Alloy", Advanced Materials Research, Vols. 194-196, pp. 1352-1356, 2011