Recrystallisation Behaviour of Cu-20Ni-5Sn Alloy

Abstract:

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Investigate effects of annealing temperature and holding time on the recrystallization temperature, hardness, microstructure and average grain size of Cu-20Ni-5Sn alloy by hardness tester, microscope and XRD. Research the kinetic mechanism of grain growth of recrystallization of Cu-20Ni-5Sn alloy. The research result shows that the recrystallization temperature declines with the increase of cold-deformation. The recrystallization temperature is at about 500°C ~650°C respectively for 50% and 60% total cold deformation, and is about 470°C ~620°C respectively for 70% and 85% total deformation. The grains grow up with the increase of annealing temperature and holding time.

Info:

Periodical:

Advanced Materials Research (Volumes 194-196)

Edited by:

Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang

Pages:

1352-1356

DOI:

10.4028/www.scientific.net/AMR.194-196.1352

Citation:

R. Q. Liu et al., "Recrystallisation Behaviour of Cu-20Ni-5Sn Alloy", Advanced Materials Research, Vols. 194-196, pp. 1352-1356, 2011

Online since:

February 2011

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Price:

$35.00

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