Combined Manufacturing Process of Electrochemical-Etching and Electroplating on Nanoporous Silicon for its Metallization

Abstract:

In this work, a combined process for simultaneously manufacturing nanoporous silicon (NPS) and its metallization was present. The key point is the utilization of adjust electrolyte of silver nitrate and the electroplating timing after the NPS etching process. The current-control mode was used to prepare NPS membrane and the obtained pore-size and pillar-depth were about 0.5 μm and 140 μm, respectively. For clarify the metallization quality of studied process, the semiconductor analyzer was utilized to measured current-voltage (IV) characteristic. Compared to NPS with conventional electroplating process, the contact properties of fabricated sample would be effectively improved by the proposed method. The obtained IV characteristic of sample with combined process shows a larger turn-on current about 277 times than other samples.

• Periodical: Advanced Materials Research (Volumes 194-196)
• Pages: 393-396
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.194-196.393
• Online since: February 2011
• Authors: Jia Chuan Lin, Meng Kai Hsu, Hsi Ting Hou, Jia Chi Pan
• Keywords: Electrochemical Etching, Electroplating, Nanoporous Silicon

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