Combined Manufacturing Process of Electrochemical-Etching and Electroplating on Nanoporous Silicon for its Metallization

Abstract:

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In this work, a combined process for simultaneously manufacturing nanoporous silicon (NPS) and its metallization was present. The key point is the utilization of adjust electrolyte of silver nitrate and the electroplating timing after the NPS etching process. The current-control mode was used to prepare NPS membrane and the obtained pore-size and pillar-depth were about 0.5 μm and 140 μm, respectively. For clarify the metallization quality of studied process, the semiconductor analyzer was utilized to measured current-voltage (IV) characteristic. Compared to NPS with conventional electroplating process, the contact properties of fabricated sample would be effectively improved by the proposed method. The obtained IV characteristic of sample with combined process shows a larger turn-on current about 277 times than other samples.

Info:

Periodical:

Advanced Materials Research (Volumes 194-196)

Edited by:

Jianmin Zeng, Taosen Li, Shaojian Ma, Zhengyi Jiang and Daoguo Yang

Pages:

393-396

DOI:

10.4028/www.scientific.net/AMR.194-196.393

Citation:

J. C. Lin et al., "Combined Manufacturing Process of Electrochemical-Etching and Electroplating on Nanoporous Silicon for its Metallization", Advanced Materials Research, Vols. 194-196, pp. 393-396, 2011

Online since:

February 2011

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Price:

$35.00

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