Thermal Design and Analysis of a Satellite Borne Electronic PCB

Abstract:

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Thermal design, finite element analysis of a satellite borne PCB is introduced in this paper. Some methods were adopted to help heat conduct and a simplified computing model was built. The analysis results show that the temperature scope of the main structure is from 45.5°C to 72.3°C in high temperature work case and all of junction temperatures of components are lower than the derated maximum junction temperatures themselves and leave enough design margins, which match the requirements of thermal analysis.

Info:

Periodical:

Advanced Materials Research (Volumes 199-200)

Edited by:

Jianmin Zeng, Zhengyi Jiang, Taosen Li, Daoguo Yang and Yun-Hae Kim

Pages:

1551-1554

DOI:

10.4028/www.scientific.net/AMR.199-200.1551

Citation:

B. Chen "Thermal Design and Analysis of a Satellite Borne Electronic PCB", Advanced Materials Research, Vols. 199-200, pp. 1551-1554, 2011

Online since:

February 2011

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Price:

$35.00

[1] B. Chen: Advanced Material Research, Vols. 156-157(2011), pp.611-614.

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[3] Y. Li: Journal of Zhengzhou University of Light Industry (Natural Science), Vol. 22(2007), p.75 (In Chinese).

[4] G.C. Fu, X.F. Wang, Tongmin Jiang: Journal of Beijing University of Aeronautics and Astronautics, Vol. 32(2006), p.716 (In Chinese).

[5] Q. Li, H.D. Liu, M.B. Zhu: Electronics Process Technology, Vol. 27(2006), p.165 (In Chinese).

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